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  1. Memory
    soldered down
  2. Mass Storage
    SD interface
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Cpu Maker
  1. NXP 4 items
  2. Qualcomm 4 items
Cpu Type
  1. NXP i.MX 8M Plus 2 items
  2. NXP i.MX 93 1 item
  3. NXP i.MX 95 1 item
  4. Qualcomm® QCS5430 1 item
  5. Qualcomm® QCS6490 2 items
  6. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 7 items
  2. ETHERNET≥2 3 items
Form Factor
  1. SMARC 3 items
  2. Modular HMIs 4 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 3 items
  2. ≥ 100 x 100mm 2 items
InstallationDepth
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. soldered down 1 item
Memory
  1. memory ≤1 12 items
  2. memory ≤16 4 items
  3. memory ≤2 8 items
  4. memory ≤4 6 items
  5. memory ≤8 7 items
  6. soldered down 8 items
  7. memory ≤32 1 item
Mounting Option
  1. VESA Mount 5 items
  2. Rear Mount 5 items
  3. Panel Mount 5 items
  4. Flush Mount 5 items
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 4 items
  3. standard SATA connector 5 items
  4. soldered down 1 item
  5. CFAST slot 1 item
  6. M.2 SATA SSD slot 10 items
  7. microSD card slot 14 items
  8. onboard eMMC 2 items
  9. onboard eMMC 33 items
  10. onboard eMMC 12 items
  11. SATA channels ≥ 1 16 items
  12. SATA channels ≥ 2 3 items
  13. SATA channels ≥ 3 1 item
  14. SD interface 14 items
  15. SD interface 8 items
  16. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 8 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 4 1 item
ScreenDimension
  1. 10-14 1 item
  2. 2 items
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 5 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 2 items
  7. USB 3.0 ≥ 2 1 item
  8. USB 3.1 ≥ 1 2 items
  9. USB CLIENT 2 items
Video Interfaces
  1. DP 3 items
  2. DUAL CHANNEL LVDS 3 items
  3. eDP 2 items
  4. MIPI-CSI camera conn 2 items
  5. MIPI-DSI 3 items
  6. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. /M/o/Modular_7_ombra_Tavola_disegno_1_1_1.jpg 1 item
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • Evaluation Kit
  • Touch Display Solutions