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  1. Memory
    soldered down
  2. Mass Storage
    SATA channels ≥ 2
  3. Pci Express
    PCI-e lanes ≥ 5
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Cpu Maker
  1. Intel 1 item
  2. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
Cpu Type
  1. Intel® Core™ 1 item
  2. Intel® Pentium® 1 item
  3. Qualcomm Dragonwing IQ9 1 item
Ethernet
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Form Factor
  1. COM Express® 1 item
  2. COM-HPC® 1 item
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Basic 1 item
Memory
  1. memory ≤1 13 items
  2. memory ≤16 14 items
  3. memory ≤2 13 items
  4. memory ≤4 14 items
  5. memory ≤8 14 items
  6. memory ≥32 13 items
  7. soldered down 2 items
  8. SO_DIMM 14 items
Mass Storage
  1. soldered down 1 item
  2. CFAST slot 1 item
  3. M.2 NVMe SSD slot 1 item
  4. SATA channels ≥ 1 1 item
  5. SATA channels ≥ 2 2 items
  6. SATA channels ≥ 3 1 item
  7. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
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  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 3 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
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USB
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  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 1 item
  7. USB 3.0 ≥ 2 1 item
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Video Interfaces
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  5. eDP 2 items
  6. HDMI 1 item
  7. MIPI-CSI camera conn 1 item
  8. PARALLEL RGB 1 item
  9. SINGLE CHANNEL LVDS 1 item
  10. VGA 1 item
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
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  • Industrial Embedded PCs
  • Payment Systems
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  • AI-Optimized Hardware
  • Evaluation Kit
  • Touch Display Solutions