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  1. Ethernet
    ETHERNET≥2
  2. Memory
    soldered down
  3. Operating Temperature
    0°C ÷ +60°C
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Cpu Maker
  1. AMD 1 item
  2. Arm System ready NXP 1 item
  3. Intel 10 items
  4. NXP 5 items
  5. Qualcomm 5 items
  6. Rockchip 2 items
Cpu Power Consumption
  1. range 10-25 W 9 items
  2. range < 10 W 13 items
  3. range < 5 W 1 item
  4. range > 25 W 1 item
Cpu Type
  1. Intel® Atom™ 8 items
  2. Intel® Celeron® 6 items
  3. Intel® Core™ 2 items
  4. Intel® Pentium® 6 items
  5. NXP i.MX 8M Mini 1 item
  6. NXP i.MX 8M Plus 1 item
  7. NXP i.MX 8X 2 items
  8. NXP i.MX 933/935 1 item
  9. NXP i.MX8 1 item
  10. Qualcomm® QCS5430 1 item
  11. Qualcomm® QCS6490 2 items
  12. Rockchip RK3399 1 item
  13. Rockchip RK3568 1 item
  14. Zynq® Ultras 1 item
  15. Qualcomm Dragonwing IQ9 1 item
Ethernet
  1. ETHERNET≥1 37 items
  2. ETHERNET≥2 24 items
Form Factor
  1. COM-HPC® 1 item
  2. SMARC 12 items
  3. Boxed Solutions 2 items
  4. Single Board Computer 9 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 11 items
  2. ≤ 80 x 80mm 7 items
  3. ≥ 100 x 100mm 9 items
Form Factor Specification
  1. 3,5" 5 items
  2. embedded NUC 1 item
  3. Pico-ITX 2 items
Memory
  1. memory ≤1 28 items
  2. memory ≤16 13 items
  3. memory ≤2 29 items
  4. memory ≤4 26 items
  5. memory ≤8 20 items
  6. memory ≥32 8 items
  7. soldered down 24 items
  8. SO_DIMM 10 items
  9. memory ≤32 1 item
  10. I2C EEPROM 1 item
  11. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. onboard SSD 3 items
  2. standard SATA connector 2 items
  3. M.2 NVMe SSD slot 1 item
  4. M.2 SATA SSD slot 5 items
  5. microSD card slot 5 items
  6. onboard eMMC 18 items
  7. onboard eMMC 3 items
  8. SATA channels ≥ 1 9 items
  9. SATA channels ≥ 2 1 item
  10. SD interface 6 items
  11. SD interface 3 items
  12. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 12 items
  2. -40°C ÷ +85°C 15 items
  3. 0°C ÷ +50°C 18 items
  4. 0°C ÷ +60°C 24 items
  5. 20°C ÷ +70°C 12 items
  6. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 10 items
  2. PCI-e lanes ≥ 2 7 items
  3. PCI-e lanes ≥ 3 4 items
  4. PCI-e lanes ≥ 4 6 items
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 11 items
  2. TTL Uarts ≥2 13 items
  3. TTL Uarts ≥3 9 items
USB
  1. USB 2.0 ≥ 1 16 items
  2. USB 2.0 ≥ 2 16 items
  3. USB 2.0 ≥ 3 11 items
  4. USB 2.0 ≥ 4 10 items
  5. USB 2.0 ≥ 5 5 items
  6. USB 2.0 ≥ 6 4 items
  7. USB 3.0 ≥ 1 10 items
  8. USB 3.0 ≥ 2 9 items
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.1 ≥ 1 4 items
  11. USB 3.1 ≥ 2 1 item
  12. USB 3.2 ≥ 2 2 items
  13. USB OTG 6 items
Video Interfaces
  1. DDI 1 item
  2. DP 9 items
  3. DP++ 10 items
  4. DUAL CHANNEL LVDS 15 items
  5. eDP 15 items
  6. HDMI 9 items
  7. MIPI-CSI camera conn 7 items
  8. MIPI-DSI 6 items
  9. SINGLE CHANNEL LVDS 14 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 6 items
  2. M.2 SOCKET 2 KEY 5 items
  3. M.2 Socket 2 key B 5 items
  4. ONBOARD WI-FI/BLE 8 items
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • Evaluation Kit
  • Touch Display Solutions