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    ETHERNET≥1
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    DP
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Cpu Maker
  1. AMD 8 items
  2. Intel 16 items
  3. MediaTek 1 item
  4. NXP 2 items
  5. Qualcomm 3 items
  6. Rockchip 2 items
Cpu Power Consumption
  1. range 10-25 W 11 items
  2. range < 10 W 8 items
  3. range > 25 W 8 items
Cpu Type
  1. AMD Ryzen™ Embedded 2 items
  2. AMD® G-Series™ 1 item
  3. AMD® R-Series 1 item
  4. AMD® Ryzen™ embedded 3 items
  5. Espressif ESP32-D0WD 1 item
  6. Intel® Atom™ 7 items
  7. Intel® Celeron® 4 items
  8. Intel® Core™ 11 items
  9. Intel® Pentium® 2 items
  10. Intel® Xeon® 1 item
  11. MediaTek Genio 510 1 item
  12. NXP i.MX 8M 1 item
  13. NXP i.MX8 1 item
  14. Qualcomm® QCS5430 1 item
  15. Qualcomm® QCS6490 1 item
  16. Rockchip RK3399 1 item
  17. Rockchip RK3588 1 item
  18. Zynq® Ultras 1 item
  19. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 32 items
  2. ETHERNET≥2 16 items
Form Factor
  1. COM Express® 14 items
  2. COM-HPC® 1 item
  3. Qseven 2 items
  4. Single Board Compute 1 item
  5. SMARC 5 items
  6. Boxed Solutions 6 items
  7. Single Board Computer 1 item
  8. Single Board Computer 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 15 items
  3. ≤ 80 x 80mm 3 items
  4. ≥ 100 x 100mm 9 items
  5. COM Express® 3 items
Form Factor Specification
  1. 3,5" 1 item
  2. COM Express Basic 4 items
  3. COM Express Compact 10 items
  4. COM-HPC Client 1 item
  5. embedded NUC 1 item
  6. Other SBCs 2 items
  7. Qseven 70x70 mm 2 items
  8. ≥ 100 x 100mm 1 item
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 24 items
  2. memory ≤16 13 items
  3. memory ≤2 24 items
  4. memory ≤4 25 items
  5. memory ≤8 22 items
  6. memory ≥32 13 items
  7. soldered down 12 items
  8. SO_DIMM 19 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. onboard SSD 2 items
  2. standard SATA connector 2 items
  3. soldered down 1 item
  4. CFAST slot 1 item
  5. M.2 NVMe SSD slot 5 items
  6. M.2 SATA SSD slot 8 items
  7. microSD card slot 6 items
  8. onboard eMMC 11 items
  9. onboard eMMC 6 items
  10. SATA channels ≥ 1 19 items
  11. SATA channels ≥ 1 4 items
  12. SATA channels ≥ 2 3 items
  13. SATA channels ≥ 2 13 items
  14. SATA channels ≥ 3 5 items
  15. SATA channels ≥ 4 4 items
  16. SD interface 3 items
  17. SD interface 2 items
  18. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 17 items
  2. -20°C ÷ +70°C 3 items
  3. -40°C ÷ +85°C 16 items
  4. 0°C ÷ +50°C 23 items
  5. 0°C ÷ +60°C 29 items
  6. 20°C ÷ +70°C 17 items
  7. -20°C ÷ +70°C 4 items
  8. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 20 items
  2. PCI-e lanes ≥ 2 19 items
  3. PCI-e lanes ≥ 3 14 items
  4. PCI-e lanes ≥ 4 14 items
  5. PCI-e lanes ≥ 5 13 items
  6. 0°C ÷ +50°C 1 item
  7. 0°C ÷ +60°C 1 item
ScreenDimension
  1. TTL Uarts ≥1 1 item
  2. RS232 1 item
Ttl Uarts
  1. TTL Uarts ≥1 18 items
  2. TTL Uarts ≥2 22 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 23 items
  2. USB 2.0 ≥ 2 21 items
  3. USB 2.0 ≥ 3 20 items
  4. USB 2.0 ≥ 4 19 items
  5. USB 2.0 ≥ 5 14 items
  6. USB 2.0 ≥ 6 15 items
  7. USB 3.0 ≥ 1 16 items
  8. USB 3.0 ≥ 2 15 items
  9. USB 3.0 ≥ 3 10 items
  10. USB 3.0 ≥ 4 8 items
  11. USB 3.1 ≥ 1 8 items
  12. USB 3.1 ≥ 2 6 items
  13. USB 3.2 ≥ 1 5 items
  14. USB 3.2 ≥ 2 6 items
  15. USB 4.0 ≥ 2 1 item
  16. USB CLIENT 1 item
  17. USB OTG 3 items
Video Interfaces
  1. DDI 16 items
  2. DP 32 items
  3. DP++ 19 items
  4. DUAL CHANNEL LVDS 44 items
  5. eDP 40 items
  6. HDMI 50 items
  7. MIPI-CSI camera conn 13 items
  8. MIPI-DSI 14 items
  9. PARALLEL RGB 4 items
  10. SINGLE CHANNEL LVDS 42 items
  11. VGA 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 10 items
  2. M.2 SOCKET 2 KEY 1 item
  3. M.2 Socket 2 key B 4 items
  4. ONBOARD WI-FI/BLE 2 items
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • Evaluation Kit
  • Touch Display Solutions