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  1. Cpu Maker
    Qualcomm
  2. Operating Temperature
    0°C ÷ +60°C
  3. Video Interfaces
    MIPI-DSI
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Cpu Maker
  1. Intel 2 items
  2. NXP 3 items
  3. Qualcomm 5 items
Cpu Type
  1. Qualcomm® QCS5430 1 item
  2. Qualcomm® QCS6490 1 item
  3. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 4 items
  2. ETHERNET≥2 3 items
Form Factor
  1. SMARC 3 items
  2. Single Board Computer 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 3 items
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 4 items
  4. memory ≤8 2 items
  5. soldered down 3 items
  6. memory ≤32 1 item
Mass Storage
  1. microSD card slot 2 items
  2. onboard eMMC 4 items
  3. SD interface 3 items
  4. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 5 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥1 4 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 4 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 2 1 item
  7. USB 3.1 ≥ 1 2 items
  8. USB 3.2 ≥ 1 2 items
Video Interfaces
  1. DP 5 items
  2. DUAL CHANNEL LVDS 4 items
  3. eDP 3 items
  4. MIPI-CSI camera conn 3 items
  5. MIPI-DSI 5 items
  6. SINGLE CHANNEL LVDS 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 2 items
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • Modular Vision
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solutions