SOM-COMe-CT6-R1000

COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded R1000 family of SoCs. (METIS - C89)

Data sheet

Wiki

Cpu

AMD Ryzen™ Embedded R1000 processors

Graphics

AMD Radeon™ Vega GPU with 3 Compute Units

Connectivity

4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3

Memory

Two DDR4 SO-DIMM Slots supporting DDR4-2400 ECC Memory

Product details

Technical Info

Description	Low-end AMD Ryzen® on COM Express® Type 6 Compact Computer on Module (CoM)
Cpu	AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.6GHz (3.5 Boost), TDP 12-25W AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.4GHz (3.3 Boost), TDP 12-25W AMD Ryzen™ Embedded R1305G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 1.5GHz (2.8 Boost), TDP 8-10W
Max Cores	2
Memory	Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 32GB
Graphics	AMD Radeon™ Vega 3 GPU with 3 Compute Units DirectX® 12 supported H.265 (10-bit) decode and 8-bit video encode VP9 decode 3 independent displays supported
Video Interfaces	Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0I eDP or Single/Dual-Channel 18-/24- bit LVDS interface (factory alternatives to third DDI port)
Video Resolution	DDIs, eDP: up to 4K LVDS: up to 1920 x 1200 @ 60Hz
Mass Storage	2 x S-ATA Gen3 Channels
Networking	Gigabit Ethernet interface Intel® I21x family GbE Controller
Usb	Up to 4 x USB 3.0 Host ports 8 x USB 2.0 Host ports
Pci	2 x PCI-e x1 Gen3 lanes Additional 3rd PCI-e x1 Gen3 lane or 3x PCI-e x1 Gen2 lanes (factory alternatives) PCI-express Graphics (PEG) x4
Audio	HD Audio Interface
Serial Ports	2 x UARTs
Other Interfaces	SPI, I2C, SM Bus, LPC bus, FAN management Optional TPM 2.0 module on-board 4x GPI, 4 x GPO
Power Supply	+12VDC ± 10% and +5VSB (optional)
Operating System	Windows 10 64-bit Linux
Operating Temperature	0°C ÷ +60 °C (Commercial version) -40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

Software

Link	SECO Technical Resources

Documentation

Data Sheet	[Datasheet] SOM-COMe-CT6-R1000 Rel 1.3
Manual	[Manual] SOM-COMe-CT6-R1000 Rel 1.1
Image	[Picture] SOM-COMe-CT6-R1000_front [Picture] SOM-COMe-CT6-R1000_back

Part Number

Grouped product items
MC89-1002-2211-C0-V	Part Number Description COMe-C89-CT6 w/AMD Ryzen Embedded R1606G @2.6GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 - Comm. Temp	Contact us
MC89-2002-2211-C0-V	Part Number Description COMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 -Comm. Temp	Contact us
MC89-3002-2222-C0-V	Part Number Description COMe-C89-CT6 w/AMD Ryzen Embedded R1305G @ 1.5GHz 8W, GbE I211, 2x DDI & LVDS, TPM1.2, 2xUSB3.0, 3x PCIe Gen3 - Comm. Temp	Contact us
MC89-1001-1212-C0-V	Part Number Description COMe-C89-CT6 w/AMD Ryzen Embedded R1606G @ 2.6GHz 15W, GbE I210, eDP, TPM SLB 9670 Q1.2, HUB - Comm. Temp	Contact us
MC89-2001-1212-C0-V	Part Number Description COMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I210, eDP, TPM SLB 9670 Q1.2, HUB - Comm. Temp	Contact us