SOM-COMe-CT6-EHL

COM Express® 3.1 Type 6 Compact Computer on Module (CoM) with Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (Codename: Elkhart Lake). (E37)

Available in Industrial Temperature Range

Data sheet

Wiki

Configurations

Cpu

Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors for IoT Applications

Graphics

Integrated Intel® Gen11 UHD graphics controller with up to 32 EU

Connectivity

1x NBase-T 2.5GbE; 4x USB3.2 Gen 1; 8x USB 2.0; 6x PCI-e lanes Gen3

Memory

Two DDR4 SO-DIMM slots supporting DDR4-3200 IBECC memory, up to 32GB

Product details

Technical Info

Description	COM Express® 3.1 Type 6 Compact Computer on Module (CoM) with Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (formerly Elkhart Lake). (E37)
Cpu	Intel® Atom® x6000E Series, and Intel® Pentium® and Celeron® N and J Series Processors: Intel® Celeron® J6413 Quad Core @ 1.8GHz (3GHz Turbo) 10W TDP, Com. Intel® Pentium® J6426 Quad Core @2.0GHz (3GHz Turbo) 10W TDP, Com. Intel® Celeron® N6211 Dual Core @1.2GHz (3GHz Turbo) 6.5W TDP, Com. Intel® Pentium® N6415 Quad Core @1.2GHz (3GHz Turbo) 6.5W TDP, Com. Intel® Atom® x6211E Dual Core @1.2GHz (3GHz Turbo) 6W TDP, IBECC, Ind. Intel® Atom® x6413E Quad Core @1.5GHz (3GHz Turbo) 9W TDP, IBECC, Ind. Intel® Atom® x6425E Quad Core @2.0GHz (3GHz Turbo) 12W TDP, IBECC, Ind. Intel® Atom® x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP, IBECC, TCC, Ind. Intel® Atom® x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP, IBECC, TCC, Ind. Intel® Atom® x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP, IBECC, TCC, Ind. ()IBECC: In-Band Error-Correcting Code memory (*)TCC: Time Coordinated Computing
Memory	Two DDR4 SO-DIMM slots supporting DDR4-3200 IBECC modules memory, up to 32GB
Graphics	Integrated Intel® Gen11 UHD Graphics controller with up to 32 EU Support up to 3 independent displays
Video Interfaces	Up to 2x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 1.4 1x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface (factory alternatives)
Video Resolution	DP 1.4 and HDMI 1.4: up to 4096x2160@60 Hz eDP 1.3: up to 4096x2160@60 Hz LVDS: up to 1920x1200 @ 60Hz
Mass Storage	2x S-ATA Gen3 channels Optional eMMC 5.1 drive soldered on-board
Networking	1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE controller, with 2.5GbE supported
Usb	Up to 4x USB 3.2 Gen 1 host ports Up to 8x USB 2.0 host ports
Pci	Up to 6x PCI-e Gen3 lanes Groupings: #1 x4 + #2 x1 #2 x2 + #2 x1 #6 x1
Audio	HD audio interface
Serial Ports	Up to 2x UARTs 1x CAN (factory alternative to one UART)
Other Interfaces	SPI, I2C, SM bus, thermal management, FAN management Optional eSPI or LPC bus (factory alternatives) Optional TPM 1.2/2.0 on-board LID#/SLEEP#/PWRBTN#, watchdog 4x GPI, 4x GPO
Power Supply	8VDC..20VDC, +5VSB (optional), +3VRTC (optional)
Operating System	Microsoft® Windows 10 IoT Enterprise 2019 LTSC Microsoft® Windows 10 IoT Enterprise 2021 LTSC Yocto Kirkstone
Operating Temperature	0°C to +60°C (commercial version) -40°C to +85°C (industrial version)
Dimensions	95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)

Software

Link	SECO Technical Resources

Documentation

Data Sheet	[Datasheet] SOM-COMe-CT6-EHL
Image	[Picture] SOM-COMe-CT6-EHL_front [Picture] SOM-COMe-CT6-EHL_back

Part Number

Grouped product items
EE37-1002-2121-C1	Part Number Description COM Express 3.1 T6 with Intel Celeron® J6413 Elkhart Lake, eDP to LVDS bridge, USB 3.0 hub, SER#1 output UART, TPM SLB	Contact us
EE37-5002-2121-I1	Part Number Description COM Express 3.1 T6 with Intel Atom® x6211E Elkhart Lake, eDP to LVDS bridge, USB 3.0 hub, SER#1 output UART, TPM SLB 9	Contact us
EE37-7001-2222-C1	Part Number Description COM Express 3.1 T6 with Intel Atom® x6425E Elkhart Lake, eDP out, eDP to LVDS bridge, USB 3.0 hub, SER#1 output CAN.	Contact us
EE37-7002-2121-I1	Part Number Description COM Express 3.1 T6 with Intel Atom® x6425E Elkhart Lake, eDP to LVDS bridge, USB 3.0 hub, SER#1 output UART, TPM SLB 9	Contact us