HMI Solutions

Touch displays

Experience in assembly services

Experience in mechanical design

Possibilities Offered by SECO

Touch integration for Resistive, Capacitive and Projected Capacitive technologies

Touch-screen customization

LCD Air Bonding, OCA, and OCR touch-screen bonding technologies

Heat dissipation solutions – both passive and active via a fan – also for the newest CPUs, with the aid of heat pipe systems where necessary.

Manufacturing of plastic elements with injection molding

Production of aluminum mechanical parts with extrusion technology

Design of mechanical parts with die-casting technology

Bending and pressing of sheet metal parts

Development of personalized wiring to manage the connection of all parts of systems containing one or more boards/displays

Description

Thanks to its experience in integrating modules and boards into complex systems, SECO has created user-ready, off-the-shelf HMI solutions with touch displays and integrated boards, based on its own ARM and x86 SBCs that are also available in our catalog. Get inspired and find ideas for your own custom solution.