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  1. SOM-SMARC-MX8M-Plus
    SOM-SMARC-MX8M-Plus
    SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8M Plus Applications Processors. (LEVY - D18)
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  1. Ethernet ETHERNET≥2 Remove This Item
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Cpu Power Consumption
  1. range < 10 W 4 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Core™  1 item
  4. Intel® Pentium®  1 item
  5. NXP i.MX 8M Mini 1 item
  6. NXP i.MX 8M Plus 1 item
  7. NXP i.MX 8X 2 item
  8. NXP i.MX 933/935 1 item
  9. NXP i.MX6  1 item
  10. NXP i.MX8  1 item
  11. Rockchip RK3399 2 item
Form Factor
  1. Boxed Solutions 1 item
  2. COM-HPC® 1 item
  3. Modular HMIs 1 item
  4. Single Board Computer  4 item
  5. SMARC 3 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 item
  2. ≤ 80 x 80mm 3 item
  3. ≥ 100 x 100mm 5 item
Form Factor Specification
  1. 3,5" 4 item
  2. COM-HPC Client 1 item
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. M.2 SATA SSD slot 1 item
  3. microSD card slot  4 item
  4. onboard eMMC 10 item
  5. SATA channels ≥ 2  1 item
  6. SD interface  4 item
Memory
  1. soldered down 8 item
  2. SO_DIMM 1 item
  3. ≤1 8 item
  4. ≤2 8 item
  5. ≤4 7 item
  6. ≤8 2 item
  7. ≥32 1 item
Operating Temperature
  1. -20°C ÷ +60°C 5 item
  2. -40°C ÷ +85°C 7 item
  3. 0°C ÷ +50°C 8 item
  4. 0°C ÷ +60°C 8 item
  5. 20°C ÷ +70°C 5 item
Pci Express
  1. PCI-e lanes ≥ 1 4 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. ≥1 5 item
  2. ≥2 5 item
  3. ≥3 5 item
USB
  1. USB 2.0 ≥ 1  8 item
  2. USB 2.0 ≥ 2  8 item
  3. USB 2.0 ≥ 3 6 item
  4. USB 2.0 ≥ 4 5 item
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 7 item
  7. USB 3.0 ≥ 2 4 item
  8. USB 3.2 ≥ 2 1 item
  9. USB 4.0 ≥ 4 1 item
  10. USB OTG 6 item
Video Interfaces
  1. DDI 1 item
  2. DP 1 item
  3. DP++ 2 item
  4. DUAL CHANNEL LVDS 6 item
  5. eDP 6 item
  6. HDMI 7 item
  7. MIPI-CSI camera connector 1 item
  8. MIPI-DSI 2 item
  9. SINGLE CHANNEL LVDS 7 item
Installation Depth
  1. 35-40 1 item
Screen Dimension
  1. 10-14 1 item