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  1. SOM-COM-HPC-A-MTL
    SOM-COM-HPC-A-MTL
    COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)
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  2. Palladio 400 RPL
    Palladio 400 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
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  3. Palladio 500 RPL
    Palladio 500 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
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  4. SOM-SMARC-MX95
    SOM-SMARC-MX95
    SMARC® Rel. 2.1.1 module with NXP i.MX 95 Applications Processors
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  5. SOM-SMARC-QCS5430
    SOM-SMARC-QCS5430
    SMARC® 2.1.1 module with Qualcomm® QCS5430 processor
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  6. SOM-SMARC-QCS6490
    SOM-SMARC-QCS6490
    SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor
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  7. SOM-SMARC-MX93
    SOM-SMARC-MX93
    SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 9 Applications Processors. (MAURY)
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  8. Santoka Vision 10.1 PM MX6
    Santoka Vision 10.1 PM MX6
    10.1 inch Panel Mount HMI based on NXP i.MX6 processor. (SANTOKA 10.1 BX PCT)
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  9. Santoka Vision 10.1 FM MX6
    Santoka Vision 10.1 FM MX6
    10.1 inch Flush Mount HMI based on NXP i.MX6 processor. (SANTOKA 10.1 SG IPS)
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  10. Titan 235 APL
    Titan 235 APL
    Fanless Embedded Computer with Intel® Atom™ X Series (codename: Apollo Lake) Processors. (CYGNUS - SYS-B68-IPC)
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Cpu Power Consumption
  1. range 10-25 W 10 item
  2. range < 10 W 12 item
  3. range > 25 W 2 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD® G-Series™ 1 item
  3. AMD® R-Series  1 item
  4. Intel® Atom™ 8 item
  5. Intel® Celeron® 7 item
  6. Intel® Core™  5 item
  7. Intel® Pentium®  6 item
  8. NXP i.MX 8M Mini 1 item
  9. NXP i.MX 8M Plus 1 item
  10. NXP i.MX 8X 2 item
  11. NXP i.MX 933/935 1 item
  12. NXP i.MX 95 1 item
  13. NXP i.MX6  3 item
  14. NXP i.MX8  1 item
  15. Qualcomm® QCS5430 1 item
  16. Qualcomm® QCS6490 1 item
  17. Rockchip RK3399 1 item
  18. Rockchip RK3568 1 item
  19. Zynq® Ultrascale+™  1 item
Form Factor
  1. Boxed Solutions 5 item
  2. COM Express® 1 item
  3. COM-HPC® 2 item
  4. Modular HMIs 2 item
  5. Single Board Computer  10 item
  6. SMARC 10 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 11 item
  2. ≤ 80 x 80mm 6 item
  3. ≥ 100 x 100mm 12 item
Form Factor Specification
  1. 3,5" 5 item
  2. COM Express Basic 1 item
  3. COM-HPC Client 1 item
  4. embedded NUC 1 item
  5. Pico-ITX 2 item
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 2 item
  3. M.2 SATA SSD slot 7 item
  4. microSD card slot  6 item
  5. onboard eMMC 23 item
  6. onboard SSD 3 item
  7. SATA channels ≥ 1 13 item
  8. SATA channels ≥ 2  5 item
  9. SATA channels ≥ 3 2 item
  10. SATA channels ≥ 4 2 item
  11. SD interface  11 item
  12. standard SATA connector 3 item
Memory
  1. soldered down 20 item
  2. SO_DIMM 6 item
  3. ≤1 26 item
  4. ≤16 8 item
  5. ≤2 25 item
  6. ≤4 23 item
  7. ≤8 17 item
  8. ≥32 4 item
Pci Express
  1. PCI-e lanes ≥ 1 15 item
  2. PCI-e lanes ≥ 2 12 item
  3. PCI-e lanes ≥ 3 6 item
  4. PCI-e lanes ≥ 4 6 item
  5. PCI-e lanes ≥ 5 2 item
Ttl Uarts
  1. ≥1 15 item
  2. ≥2 16 item
  3. ≥3 8 item
USB
  1. USB 2.0 ≥ 1  22 item
  2. USB 2.0 ≥ 2  23 item
  3. USB 2.0 ≥ 3 17 item
  4. USB 2.0 ≥ 4 13 item
  5. USB 2.0 ≥ 5 6 item
  6. USB 2.0 ≥ 6 5 item
  7. USB 3.0 ≥ 1 11 item
  8. USB 3.0 ≥ 2 9 item
  9. USB 3.0 ≥ 3 2 item
  10. USB 3.0 ≥ 4 1 item
  11. USB 3.1 ≥ 1 5 item
  12. USB 3.1 ≥ 2 3 item
  13. USB 3.2 ≥ 1 4 item
  14. USB 3.2 ≥ 2 5 item
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 1 item
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 1 item
  19. USB OTG 10 item
Video Interfaces
  1. DDI 1 item
  2. DP 10 item
  3. DP++ 11 item
  4. DUAL CHANNEL LVDS 15 item
  5. eDP 16 item
  6. HDMI 15 item
  7. MIPI-CSI camera connector 4 item
  8. MIPI-DSI 6 item
  9. SINGLE CHANNEL LVDS 13 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 10 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 5 item
  3. M.2 Socket 2 key B (SSD) 6 item
  4. ONBOARD WI-FI/BLE 8 item
Installation Depth
  1. 35-40 2 item
Screen Dimension
  1. 10-14 2 item