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SB68-DISS-1-I-PK
In stock
SBC - SBC-B68-eNUC Heat Spreader (PASSIVE) for Atom E39xx CPUs - Packaged
$0.00
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Description
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Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed temperature range. The operating temperature specified in the Technical Features of the module/board indicates the temperature range in which any and all parts of the heat spreader / heat sink must remain, in order for SECO to guarantee functionality. Hence, these numbers do not necessarily indicate the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is the customer’s responsibility to design and apply an application-dependent cooling system, capable of ensuring that the heat spreader / heat sink temperature remain within the indicated range of the module. It is an absolute requirement that customers, after thorough evaluation of the processor’s workload in the actual system application, the system enclosure and consequent air flow/Thermal analysis, accurately study and develop a suitable cooling solution for the assembled system. |
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