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3.5-inch SBC

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SBC-3.5-TGL-UP3

SBC-3.5-TGL-UP3

3.5” SBC with 11th Gen Intel® Core™ and Intel® Celeron® (codename: Tiger Lake-UP3). (PRISMA - D64)

SBC-3.5-RV1000

SBC-3.5-RV1000

3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)

SBC-3.5-RK3568

SBC-3.5-RK3568

3.5” SBC with Rockchip RK3568 SoC. (SAYLOR - E09)

SBC-3.5-RK3399

SBC-3.5-RK3399

3.5” SBC with Rockchip RK3399 SoC. (SOLON - C31)

SBC-3.5-MX8X

SBC-3.5-MX8X

3.5” SBC with NXP i.MX 8X Applications Processors. (VESTA - C57)

3.5-inch SBC

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  1. Form Factor Dimensions
    ≥ 100 x 100mm
  2. Operating Temperature
    -20°C ÷ +60°C
  3. USB
    USB 3.0 ≥ 2
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Cpu Maker
  1. AMD 1 item
  2. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
  3. range > 25 W 1 item
Cpu Type
  1. AMD Ryzen™ Embedded 1 item
  2. AMD® Ryzen™ embedded 1 item
  3. Rockchip RK3399 1 item
Ethernet
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  2. ETHERNET≥2 2 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 2 items
Memory
  1. memory ≤1 2 items
  2. memory ≤16 1 item
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 1 item
  6. memory ≥32 1 item
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  8. SO_DIMM 1 item
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. microSD card slot 2 items
  3. onboard eMMC 1 item
  4. SATA channels ≥ 1 1 item
  5. SATA channels ≥ 2 1 item
Operating Temperature
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  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
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USB
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  2. USB 2.0 ≥ 2 5 items
  3. USB 2.0 ≥ 3 5 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 5 items
  7. USB 3.0 ≥ 2 2 items
  8. USB 3.0 ≥ 3 1 item
  9. USB OTG 3 items
Video Interfaces
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  2. DP++ 1 item
  3. DUAL CHANNEL LVDS 1 item
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  5. HDMI 1 item
  6. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
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  2. M.2 SOCKET 2 KEY 1 item
  3. ONBOARD WI-FI/BLE 1 item