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3.5-inch SBC

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SBC-3.5-TGL-UP3

SBC-3.5-TGL-UP3

3.5” SBC with 11th Gen Intel® Core™ and Intel® Celeron® (codename: Tiger Lake-UP3). (PRISMA - D64)

SBC-3.5-RV1000

SBC-3.5-RV1000

3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)

SBC-3.5-RK3568

SBC-3.5-RK3568

3.5” SBC with Rockchip RK3568 SoC. (SAYLOR - E09)

SBC-3.5-RK3399

SBC-3.5-RK3399

3.5” SBC with Rockchip RK3399 SoC. (SOLON - C31)

SBC-3.5-MX8X

SBC-3.5-MX8X

3.5” SBC with NXP i.MX 8X Applications Processors. (VESTA - C57)

3.5-inch SBC

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  1. Cpu Maker
    NXP
  2. Form Factor Dimensions
    ≥ 100 x 100mm
  3. Operating Temperature
    -40°C ÷ +85°C
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Cpu Maker
  1. AMD 1 item
  2. Arm System ready NXP 1 item
  3. NXP 3 items
Cpu Type
  1. NXP i.MX 8M 1 item
  2. NXP i.MX 8X 1 item
  3. NXP i.MX8 1 item
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 2 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 3 items
Memory
  1. memory ≤1 3 items
  2. memory ≤2 3 items
  3. memory ≤4 2 items
  4. memory ≤8 1 item
  5. soldered down 3 items
Mass Storage
  1. microSD card slot 2 items
  2. onboard eMMC 3 items
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
  1. TTL Uarts ≥1 3 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 3 items
  7. USB OTG 2 items
Video Interfaces
  1. DUAL CHANNEL LVDS 2 items
  2. eDP 2 items
  3. HDMI 1 item
  4. SINGLE CHANNEL LVDS 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 SOCKET 2 KEY 2 items
  3. ONBOARD WI-FI/BLE 3 items