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Titan 300 TGL-UP3 AIFanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPSx86 Intel Processor Fanless Embedded PCs AI-Optimized Hardware -
SOM-SMARC-ASLSMARC® Rel 2.1 compliant module with Intel Atom® Processors x7000RE Series for the Edge. (E08)x86 Computer on Module SMARC® Intel Processor -
SOM-COMe-CT6-EHLCOM Express® 3.1 Type 6 Compact Computer on Module (CoM) with Intel Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (Codename: Elkhart Lake). (E37)x86 COM Express® Intel Processor -
SOM-COM-HPC-A-TGL-HCOM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (D57)x86 COM-HPC® Intel Processor AI-Optimized Hardware -
SOM-COM-HPC-A-MTLCOM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U). (E87)x86 Computer on Module COM-HPC® Intel Processor -
Palladio 500 RPLModular embedded PC with 13th Gen Intel® Core™ processorsx86 Intel Processor Industrial Embedded PCs AI-Optimized Hardware




