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Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)Intel Processor Fanless Embedded PCs -
SOM-SMARC-TWLSMARC® Rel. 2.1 compliant module with Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E08)Computer on Module SMARC® Intel Processor -
SOM-SMARC-ADL-NSMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N). (E08)x86 Computer on Module SMARC® Intel Processor -
SOM-COMe-BT6-SKL/KLCOM Express® Basic Type 6 Computer on Module (CoM) with Intel® 6th and 7th generation Core™ / Xeon® (Codename: Skylake and Kaby Lake) CPUs. (TARVOS - B09)x86 COM Express® Intel Processor -
SOM-COM-HPC-A-TGL-UP3COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77)x86 Computer on Module COM-HPC® Intel Processor -
SOM-COM-HPC-A-TGL-HCOM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (D57)x86 COM-HPC® Intel Processor AI-Optimized Hardware




