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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS

Intel Processor

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  1. Cpu Type
    Intel® Xeon®
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    COM Express®
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Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range > 25 W 1 item
Cpu Type
  1. Intel® Atom™ 5 items
  2. Intel® Celeron® 5 items
  3. Intel® Core™ 11 items
  4. Intel® Pentium® 3 items
  5. Intel® Xeon® 1 item
Form Factor
  1. COM Express® 1 item
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Memory
  1. memory ≤1 1 item
  2. memory ≤16 1 item
  3. memory ≤2 1 item
  4. memory ≤4 1 item
  5. memory ≤8 1 item
  6. memory ≥32 1 item
  7. SO_DIMM 1 item
Mass Storage
  1. SATA channels ≥ 1 1 item
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  4. SATA channels ≥ 4 1 item
  5. SD interface 1 item
Operating Temperature
  1. 0°C ÷ +50°C 1 item
  2. 0°C ÷ +60°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 1 item
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  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
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  10. USB 3.0 ≥ 4 1 item
Video Interfaces
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