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SOM-SMARC-MX952

SOM-SMARC-MX952

SMARC® Rel. 2.1.1 module with NXP i.MX 952 Applications Processor
SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.2 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

SOM-SMARC-ZU

SOM-SMARC-ZU

SMARC® Rel. 2.0 Computer on Module (CoM) with Zynq® Ultrascale+™ MPSoC. (RUSSELL - B71)

SOM-SMARC-TWL

SOM-SMARC-TWL

SMARC® Rel. 2.1 compliant module with Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E08)

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)

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  1. Memory
    memory ≤16
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    TTL Uarts ≥1
  3. Video Interfaces
    MIPI-CSI camera conn
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Cpu Maker
  1. Intel 1 item
  2. NXP 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. NXP i.MX 95 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 2 items
Form Factor Specification
  1. ≤ 100 x 100mm 1 item
Memory
  1. memory ≤1 5 items
  2. memory ≤16 2 items
  3. memory ≤2 5 items
  4. memory ≤4 5 items
  5. memory ≤8 4 items
  6. soldered down 4 items
Mass Storage
  1. onboard eMMC 1 item
  2. onboard eMMC 1 item
  3. SATA channels ≥ 1 1 item
  4. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 1 item
  5. 20°C ÷ +70°C 1 item
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 3 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 2 items
  7. USB 3.2 ≥ 1 1 item
  8. USB 3.2 ≥ 2 1 item
  9. USB OTG 1 item
Video Interfaces
  1. DP 1 item
  2. DP++ 2 items
  3. DUAL CHANNEL LVDS 2 items
  4. eDP 2 items
  5. HDMI 3 items
  6. MIPI-CSI camera conn 2 items
  7. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item