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SOM-COMe-CT6-Dragonwing-IQ9

SOM-COMe-CT6-Dragonwing-IQ9

COM Express® 3.1 Type 6 Compact Module with Qualcomm Dragonwing™ IQ9 Processors. (F99)

/images/com_express/som-come-ct6-p100-front-main.jpg

SOM-COMe-CT6-P100

COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series. (F45)

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

SOM-COMe-CT6-WHL-U

SOM-COMe-CT6-WHL-U

COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 8th Gen Intel® Core™ and Celeron™ U-series (Codename: Whiskey Lake-U) Processors. (LARISSA - C55)

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  1. Ethernet
    ETHERNET≥1
  2. Operating Temperature
    0°C ÷ +60°C
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Cpu Maker
  1. AMD 5 items
  2. Intel 11 items
  3. Qualcomm 1 item
  4. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 7 items
  2. range < 10 W 1 item
  3. range > 25 W 8 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 2 items
  4. Intel® Atom™ 4 items
  5. Intel® Celeron® 3 items
  6. Intel® Core™ 9 items
  7. Intel® Pentium® 2 items
  8. Intel® Xeon® 1 item
  9. Rockchip RK3588 1 item
  10. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 18 items
  2. ETHERNET≥2 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 items
  2. ≤ 100 x 100mm 9 items
  3. ≥ 100 x 100mm 3 items
  4. COM Express® 3 items
Form Factor Specification
  1. COM Express Basic 7 items
  2. COM Express Compact 11 items
Memory
  1. memory ≤1 11 items
  2. memory ≤16 10 items
  3. memory ≤2 10 items
  4. memory ≤4 11 items
  5. memory ≤8 11 items
  6. memory ≥32 13 items
  7. soldered down 1 item
  8. SO_DIMM 13 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. soldered down 1 item
  2. M.2 NVMe SSD slot 2 items
  3. M.2 SATA SSD slot 2 items
  4. microSD card slot 2 items
  5. onboard eMMC 5 items
  6. onboard eMMC 1 item
  7. SATA channels ≥ 1 12 items
  8. SATA channels ≥ 1 1 item
  9. SATA channels ≥ 2 1 item
  10. SATA channels ≥ 2 3 items
  11. SATA channels ≥ 2 12 items
  12. SATA channels ≥ 3 1 item
  13. SATA channels ≥ 4 1 item
  14. SD interface 1 item
  15. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 9 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 13 items
  4. 0°C ÷ +50°C 11 items
  5. 0°C ÷ +60°C 18 items
  6. 20°C ÷ +70°C 8 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 12 items
  2. PCI-e lanes ≥ 2 12 items
  3. PCI-e lanes ≥ 3 12 items
  4. PCI-e lanes ≥ 4 13 items
  5. PCI-e lanes ≥ 5 16 items
Ttl Uarts
  1. TTL Uarts ≥1 12 items
  2. TTL Uarts ≥2 16 items
USB
  1. USB 2.0 ≥ 1 11 items
  2. USB 2.0 ≥ 2 10 items
  3. USB 2.0 ≥ 3 10 items
  4. USB 2.0 ≥ 4 10 items
  5. USB 2.0 ≥ 5 10 items
  6. USB 2.0 ≥ 6 14 items
  7. USB 3.0 ≥ 1 8 items
  8. USB 3.0 ≥ 2 8 items
  9. USB 3.0 ≥ 3 8 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 4 items
  12. USB 3.1 ≥ 2 4 items
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 2 items
  15. USB 4.0 ≥ 2 3 items
  16. USB CLIENT 1 item
  17. USB OTG 2 items
Video Interfaces
  1. DDI 14 items
  2. DP 13 items
  3. DUAL CHANNEL LVDS 14 items
  4. eDP 16 items
  5. HDMI 14 items
  6. MIPI-CSI camera conn 4 items
  7. SINGLE CHANNEL LVDS 13 items
  8. VGA 3 items