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  1. USB
    USB 2.0 ≥ 5
  2. Video Interfaces
    DUAL CHANNEL LVDS
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Cpu Maker
  1. AMD 2 items
  2. Intel 15 items
  3. MediaTek 1 item
  4. NXP 2 items
  5. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 11 items
  2. range < 10 W 9 items
  3. range > 25 W 3 items
Cpu Type
  1. AMD Ryzen™ Embedded 1 item
  2. AMD® Ryzen™ embedded 1 item
  3. Intel® Atom™ 10 items
  4. Intel® Celeron® 9 items
  5. Intel® Core™ 7 items
  6. Intel® Pentium® 5 items
  7. Intel® Xeon® 1 item
  8. MediaTek Genio 510 1 item
  9. NXP i.MX 8M 1 item
  10. NXP i.MX 8M Mini 1 item
  11. NXP i.MX 8M Nano 1 item
  12. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 19 items
  2. ETHERNET≥2 4 items
Form Factor
  1. COM Express® 11 items
  2. Qseven 5 items
  3. SMARC 5 items
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  2. ≤ 100 x 100mm 18 items
  3. ≤ 80 x 80mm 7 items
  4. ≥ 100 x 100mm 2 items
  5. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 3 items
  2. COM Express Compact 8 items
  3. Qseven 70x70 mm 4 items
  4. µQseven 70x40 1 item
Memory
  1. memory ≤1 19 items
  2. memory ≤16 12 items
  3. memory ≤2 19 items
  4. memory ≤4 20 items
  5. memory ≤8 18 items
  6. memory ≥32 7 items
  7. soldered down 11 items
  8. SO_DIMM 11 items
  9. memory ≤32 1 item
Mass Storage
  1. onboard SSD 1 item
  2. CFAST slot 1 item
  3. M.2 NVMe SSD slot 1 item
  4. microSD card slot 2 items
  5. onboard eMMC 14 items
  6. SATA channels ≥ 1 17 items
  7. SATA channels ≥ 2 14 items
  8. SATA channels ≥ 3 3 items
  9. SATA channels ≥ 4 1 item
  10. SD interface 7 items
  11. SD interface 1 item
  12. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 14 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 16 items
  4. 0°C ÷ +50°C 17 items
  5. 0°C ÷ +60°C 18 items
  6. 20°C ÷ +70°C 14 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 19 items
  2. PCI-e lanes ≥ 2 17 items
  3. PCI-e lanes ≥ 3 17 items
  4. PCI-e lanes ≥ 4 16 items
  5. PCI-e lanes ≥ 5 10 items
Ttl Uarts
  1. TTL Uarts ≥1 19 items
  2. TTL Uarts ≥2 15 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 31 items
  2. USB 2.0 ≥ 2 30 items
  3. USB 2.0 ≥ 3 27 items
  4. USB 2.0 ≥ 4 25 items
  5. USB 2.0 ≥ 5 21 items
  6. USB 2.0 ≥ 6 19 items
  7. USB 3.0 ≥ 1 20 items
  8. USB 3.0 ≥ 2 17 items
  9. USB 3.0 ≥ 3 9 items
  10. USB 3.0 ≥ 4 6 items
  11. USB 3.1 ≥ 1 9 items
  12. USB 3.1 ≥ 2 6 items
  13. USB 3.2 ≥ 1 2 items
  14. USB 3.2 ≥ 2 3 items
  15. USB 4.0 ≥ 2 3 items
  16. USB CLIENT 1 item
  17. USB OTG 12 items
Video Interfaces
  1. DDI 12 items
  2. DP 17 items
  3. DP++ 7 items
  4. DUAL CHANNEL LVDS 21 items
  5. eDP 23 items
  6. HDMI 21 items
  7. MIPI-CSI camera conn 5 items
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 19 items
  11. VGA 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. ONBOARD WI-FI/BLE 2 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)