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COM Express®
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Trizeps SODIMM (SOM)

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  1. USB
    USB 3.2 ≥ 2
  2. Video Interfaces
    DP
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Cpu Power Consumption
  1. range > 25 W 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Core™ 2 items
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 2 items
Form Factor
  1. COM Express® 1 item
  2. COM-HPC® 1 item
  3. SMARC 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
  2. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. COM-HPC Client 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤16 2 items
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 2 items
  6. memory ≥32 2 items
  7. soldered down 1 item
  8. SO_DIMM 2 items
Mass Storage
  1. M.2 NVMe SSD slot 2 items
  2. onboard eMMC 1 item
  3. SATA channels ≥ 1 2 items
  4. SATA channels ≥ 2 1 item
  5. SATA channels ≥ 2 1 item
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 3 items
USB
  1. USB 2.0 ≥ 1 18 items
  2. USB 2.0 ≥ 2 17 items
  3. USB 2.0 ≥ 3 17 items
  4. USB 2.0 ≥ 4 16 items
  5. USB 2.0 ≥ 5 14 items
  6. USB 2.0 ≥ 6 15 items
  7. USB 3.0 ≥ 1 11 items
  8. USB 3.0 ≥ 2 10 items
  9. USB 3.0 ≥ 3 8 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 8 items
  12. USB 3.1 ≥ 2 5 items
  13. USB 3.2 ≥ 1 2 items
  14. USB 3.2 ≥ 2 3 items
  15. USB 4.0 ≥ 2 1 item
  16. USB CLIENT 1 item
  17. USB OTG 3 items
Video Interfaces
  1. DDI 4 items
  2. DP 3 items
  3. DP++ 5 items
  4. DUAL CHANNEL LVDS 3 items
  5. eDP 8 items
  6. HDMI 5 items
  7. MIPI-CSI camera conn 2 items
  8. SINGLE CHANNEL LVDS 2 items
  9. VGA 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)