Menu
Account
Computer on Module
COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)

Computer on Module

Shop By
Clear All

Items 1-6 of 21

Set Descending Direction
Page
per page
Shop By
Now Shopping by
  1. Operating Temperature
    -40°C ÷ +85°C
  2. Ttl Uarts
    TTL Uarts ≥2
  3. Video Interfaces
    DUAL CHANNEL LVDS
Clear All
Shopping Options
Cpu Maker
  1. AMD 4 items
  2. Intel 8 items
  3. MediaTek 1 item
  4. NXP 7 items
  5. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 6 items
  2. range < 10 W 7 items
  3. range < 5 W 2 items
  4. range > 25 W 4 items
Cpu Type
  1. AMD Ryzen™ Embedded 2 items
  2. AMD® Ryzen™ embedded 1 item
  3. Intel® Atom™ 6 items
  4. Intel® Celeron® 3 items
  5. Intel® Core™ 4 items
  6. Intel® Pentium® 3 items
  7. MediaTek Genio 510 1 item
  8. NXP i.MX 8M 3 items
  9. NXP i.MX 8M Mini 1 item
  10. NXP i.MX 8M Nano 1 item
  11. NXP i.MX 8X 1 item
  12. NXP i.MX6 2 items
  13. Zynq® Ultras 1 item
  14. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 20 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 9 items
  2. Myon MicroModule SOM 1 item
  3. Qseven 3 items
  4. SMARC 7 items
  5. Trizeps SODIMM SOM 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 48,5 x 32,5 mm 1 item
  3. 67,6 x 36,7 mm 1 item
  4. ≤ 100 x 100mm 16 items
  5. ≤ 80 x 80mm 7 items
  6. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 1 item
  2. COM Express Compact 8 items
  3. Qseven 70x70 mm 2 items
  4. µQseven 70x40 1 item
Memory
  1. memory ≤1 18 items
  2. memory ≤16 8 items
  3. memory ≤2 17 items
  4. memory ≤4 17 items
  5. memory ≤8 13 items
  6. memory ≥32 5 items
  7. soldered down 11 items
  8. SO_DIMM 8 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. M.2 NVMe SSD slot 1 item
  4. microSD card slot 2 items
  5. onboard eMMC 16 items
  6. SATA channels ≥ 1 12 items
  7. SATA channels ≥ 2 2 items
  8. SATA channels ≥ 2 6 items
  9. SD interface 6 items
  10. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 18 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 21 items
  4. 0°C ÷ +50°C 20 items
  5. 0°C ÷ +60°C 24 items
  6. 20°C ÷ +70°C 18 items
  7. -20°C ÷ +70°C 5 items
Pci Express
  1. PCI-e lanes ≥ 1 17 items
  2. PCI-e lanes ≥ 2 12 items
  3. PCI-e lanes ≥ 3 11 items
  4. PCI-e lanes ≥ 4 11 items
  5. PCI-e lanes ≥ 5 9 items
Ttl Uarts
  1. TTL Uarts ≥1 22 items
  2. TTL Uarts ≥2 21 items
  3. TTL Uarts ≥3 8 items
USB
  1. USB 2.0 ≥ 1 17 items
  2. USB 2.0 ≥ 2 17 items
  3. USB 2.0 ≥ 3 15 items
  4. USB 2.0 ≥ 4 13 items
  5. USB 2.0 ≥ 5 11 items
  6. USB 2.0 ≥ 6 12 items
  7. USB 3.0 ≥ 1 11 items
  8. USB 3.0 ≥ 2 10 items
  9. USB 3.0 ≥ 3 5 items
  10. USB 3.0 ≥ 4 3 items
  11. USB 3.1 ≥ 1 5 items
  12. USB 3.1 ≥ 2 4 items
  13. USB 3.2 ≥ 1 2 items
  14. USB 3.2 ≥ 2 3 items
  15. USB 4.0 ≥ 2 1 item
  16. USB OTG 6 items
Video Interfaces
  1. DDI 10 items
  2. DP 14 items
  3. DP++ 6 items
  4. DUAL CHANNEL LVDS 21 items
  5. eDP 20 items
  6. HDMI 21 items
  7. MIPI-CSI camera conn 5 items
  8. MIPI-DSI 8 items
  9. PARALLEL RGB 3 items
  10. SINGLE CHANNEL LVDS 20 items
  11. VGA 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. ONBOARD WI-FI/BLE 3 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)