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COM Express®
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  1. Operating Temperature
    -20°C ÷ +60°C
  2. Video Interfaces
    DP
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Cpu Maker
  1. AMD 3 items
  2. Intel 4 items
  3. MediaTek 1 item
  4. NXP 2 items
  5. Qualcomm 2 items
Cpu Power Consumption
  1. range 10-25 W 4 items
  2. range < 10 W 4 items
  3. range > 25 W 3 items
Cpu Type
  1. AMD Ryzen™ Embedded 1 item
  2. AMD® Ryzen™ embedded 1 item
  3. Intel® Atom™ 3 items
  4. Intel® Celeron® 1 item
  5. Intel® Core™ 3 items
  6. Intel® Pentium® 1 item
  7. MediaTek Genio 510 1 item
  8. NXP i.MX 8M 1 item
  9. NXP i.MX8 1 item
  10. Qualcomm® QCS5430 1 item
  11. Qualcomm® QCS6490 1 item
  12. Zynq® Ultras 1 item
Ethernet
  1. ETHERNET≥1 12 items
  2. ETHERNET≥2 3 items
Form Factor
  1. COM Express® 6 items
  2. Qseven 2 items
  3. SMARC 4 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 11 items
  2. ≤ 80 x 80mm 3 items
  3. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Compact 6 items
  2. Qseven 70x70 mm 2 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 12 items
  2. memory ≤16 5 items
  3. memory ≤2 11 items
  4. memory ≤4 12 items
  5. memory ≤8 10 items
  6. memory ≥32 2 items
  7. soldered down 6 items
  8. SO_DIMM 6 items
Mass Storage
  1. microSD card slot 2 items
  2. onboard eMMC 8 items
  3. onboard eMMC 2 items
  4. SATA channels ≥ 1 8 items
  5. SATA channels ≥ 2 6 items
  6. SD interface 2 items
  7. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 12 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 16 items
  4. 0°C ÷ +50°C 15 items
  5. 0°C ÷ +60°C 21 items
  6. 20°C ÷ +70°C 12 items
  7. -20°C ÷ +70°C 5 items
Pci Express
  1. PCI-e lanes ≥ 1 11 items
  2. PCI-e lanes ≥ 2 10 items
  3. PCI-e lanes ≥ 3 7 items
  4. PCI-e lanes ≥ 4 7 items
  5. PCI-e lanes ≥ 5 5 items
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 12 items
  2. TTL Uarts ≥2 11 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 12 items
  2. USB 2.0 ≥ 2 12 items
  3. USB 2.0 ≥ 3 12 items
  4. USB 2.0 ≥ 4 11 items
  5. USB 2.0 ≥ 5 8 items
  6. USB 2.0 ≥ 6 6 items
  7. USB 3.0 ≥ 1 9 items
  8. USB 3.0 ≥ 2 7 items
  9. USB 3.0 ≥ 3 6 items
  10. USB 3.0 ≥ 4 3 items
  11. USB 3.1 ≥ 1 6 items
  12. USB 3.1 ≥ 2 3 items
  13. USB OTG 3 items
Video Interfaces
  1. DDI 7 items
  2. DP 12 items
  3. DP++ 2 items
  4. DUAL CHANNEL LVDS 19 items
  5. eDP 15 items
  6. HDMI 15 items
  7. MIPI-CSI camera conn 4 items
  8. MIPI-DSI 5 items
  9. SINGLE CHANNEL LVDS 16 items
  10. VGA 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. ONBOARD WI-FI/BLE 1 item
  3. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)