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  1. Operating Temperature
    0°C ÷ +60°C
  2. Video Interfaces
    eDP
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Cpu Maker
  1. AMD 5 items
  2. Intel 21 items
  3. MediaTek 1 item
  4. NXP 3 items
  5. Qualcomm 3 items
  6. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 11 items
  2. range < 10 W 8 items
  3. range > 25 W 7 items
Cpu Type
  1. AMD Ryzen™ Embedded 2 items
  2. AMD® Ryzen™ embedded 3 items
  3. Intel® Atom™ 9 items
  4. Intel® Celeron® 9 items
  5. Intel® Core™ 15 items
  6. Intel® Pentium® 7 items
  7. Intel® Xeon® 2 items
  8. MediaTek Genio 510 1 item
  9. NXP i.MX 8M 1 item
  10. NXP i.MX 8M Mini 1 item
  11. NXP i.MX 8M Nano 1 item
  12. NXP i.MX 8X 1 item
  13. Qualcomm® QCS5430 1 item
  14. Qualcomm® QCS6490 1 item
  15. Rockchip RK3588 1 item
  16. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 27 items
  2. ETHERNET≥2 10 items
Form Factor
  1. COM Express® 18 items
  2. COM-HPC® 4 items
  3. Qseven 4 items
  4. SMARC 8 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 4 items
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. ≤ 100 x 100mm 19 items
  4. ≤ 80 x 80mm 8 items
  5. ≥ 100 x 100mm 3 items
  6. COM Express® 3 items
Form Factor Specification
  1. COM Express Basic 7 items
  2. COM Express Compact 11 items
  3. COM-HPC Client 3 items
  4. Qseven 70x70 mm 3 items
  5. µQseven 70x40 1 item
Memory
  1. memory ≤1 21 items
  2. memory ≤16 13 items
  3. memory ≤2 21 items
  4. memory ≤4 21 items
  5. memory ≤8 18 items
  6. memory ≥32 14 items
  7. soldered down 14 items
  8. SO_DIMM 16 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. soldered down 1 item
  2. CFAST slot 1 item
  3. M.2 NVMe SSD slot 4 items
  4. M.2 SATA SSD slot 3 items
  5. microSD card slot 3 items
  6. onboard eMMC 15 items
  7. onboard eMMC 3 items
  8. SATA channels ≥ 1 17 items
  9. SATA channels ≥ 1 1 item
  10. SATA channels ≥ 2 1 item
  11. SATA channels ≥ 2 4 items
  12. SATA channels ≥ 2 14 items
  13. SATA channels ≥ 3 2 items
  14. SATA channels ≥ 4 1 item
  15. SD interface 6 items
  16. SD interface 2 items
  17. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 15 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 23 items
  4. 0°C ÷ +50°C 20 items
  5. 0°C ÷ +60°C 34 items
  6. 20°C ÷ +70°C 16 items
  7. -20°C ÷ +70°C 5 items
Pci Express
  1. PCI-e lanes ≥ 1 22 items
  2. PCI-e lanes ≥ 2 19 items
  3. PCI-e lanes ≥ 3 16 items
  4. PCI-e lanes ≥ 4 20 items
  5. PCI-e lanes ≥ 5 18 items
Ttl Uarts
  1. TTL Uarts ≥1 22 items
  2. TTL Uarts ≥2 26 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 23 items
  2. USB 2.0 ≥ 2 22 items
  3. USB 2.0 ≥ 3 22 items
  4. USB 2.0 ≥ 4 21 items
  5. USB 2.0 ≥ 5 18 items
  6. USB 2.0 ≥ 6 21 items
  7. USB 3.0 ≥ 1 13 items
  8. USB 3.0 ≥ 2 12 items
  9. USB 3.0 ≥ 3 9 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 9 items
  12. USB 3.1 ≥ 2 6 items
  13. USB 3.2 ≥ 1 4 items
  14. USB 3.2 ≥ 2 6 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 5 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 1 item
  19. USB CLIENT 2 items
  20. USB OTG 6 items
Video Interfaces
  1. DDI 17 items
  2. DP 21 items
  3. DP++ 9 items
  4. DUAL CHANNEL LVDS 32 items
  5. eDP 34 items
  6. HDMI 31 items
  7. MIPI-CSI camera conn 11 items
  8. MIPI-DSI 8 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 27 items
  11. VGA 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. ONBOARD WI-FI/BLE 3 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)