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COM Express®
COM-HPC®
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  1. Mass Storage
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  2. Video Interfaces
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Cpu Maker
  1. MediaTek 1 item
  2. Rockchip 1 item
Cpu Type
  1. Rockchip RK3588 1 item
  2. MediaTek Genio360 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 1 item
  2. Trizeps SODIMM SOM 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 67,6 x 36,7 mm 1 item
Form Factor Specification
  1. COM Express Basic 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≥32 1 item
Mass Storage
  1. onboard SSD 1 item
  2. CFAST slot 1 item
  3. M.2 NVMe SSD slot 5 items
  4. M.2 SATA SSD slot 3 items
  5. microSD card slot 5 items
  6. onboard eMMC 19 items
  7. onboard eMMC 2 items
  8. SATA channels ≥ 1 17 items
  9. SATA channels ≥ 1 2 items
  10. SATA channels ≥ 2 1 item
  11. SATA channels ≥ 2 4 items
  12. SATA channels ≥ 2 14 items
  13. SATA channels ≥ 3 3 items
  14. SATA channels ≥ 4 1 item
  15. SD interface 10 items
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +60°C 1 item
Pci Express
  1. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 3.0 ≥ 1 1 item
  3. USB 3.0 ≥ 2 1 item
  4. USB CLIENT 1 item
Video Interfaces
  1. DP 3 items
  2. DUAL CHANNEL LVDS 2 items
  3. eDP 3 items
  4. HDMI 2 items
  5. MIPI-CSI camera conn 1 item
  6. MIPI-DSI 3 items
  7. PARALLEL RGB 1 item
  8. SINGLE CHANNEL LVDS 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)