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  1. Memory
    memory ≤8
  2. Operating Temperature
    0°C ÷ +50°C
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Cpu Maker
  1. AMD 4 items
  2. Intel 15 items
  3. MediaTek 2 items
  4. NXP 1 item
  5. Qualcomm 2 items
Cpu Power Consumption
  1. range 10-25 W 12 items
  2. range < 10 W 8 items
  3. range > 25 W 5 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 1 item
  3. AMD® Ryzen™ embedded 1 item
  4. Intel® Atom™ 9 items
  5. Intel® Celeron® 8 items
  6. Intel® Core™ 8 items
  7. Intel® Pentium® 6 items
  8. Intel® Xeon® 1 item
  9. MediaTek Genio 510 1 item
  10. MediaTek Genio 700 1 item
  11. NXP i.MX 95 1 item
  12. Qualcomm® QCS5430 1 item
  13. Qualcomm® QCS6490 1 item
  14. Zynq® Ultras 1 item
Ethernet
  1. ETHERNET≥1 23 items
  2. ETHERNET≥2 8 items
Form Factor
  1. COM Express® 12 items
  2. COM-HPC® 1 item
  3. Qseven 3 items
  4. SMARC 8 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 18 items
  2. ≤ 80 x 80mm 6 items
  3. ≥ 100 x 100mm 4 items
  4. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 4 items
  2. COM Express Compact 8 items
  3. COM-HPC Client 1 item
  4. Qseven 70x70 mm 3 items
Memory
  1. memory ≤1 32 items
  2. memory ≤16 14 items
  3. memory ≤2 31 items
  4. memory ≤4 31 items
  5. memory ≤8 24 items
  6. memory ≥32 9 items
  7. soldered down 19 items
  8. SO_DIMM 12 items
  9. I2C EEPROM 1 item
  10. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. onboard SSD 1 item
  2. CFAST slot 1 item
  3. M.2 NVMe SSD slot 2 items
  4. microSD card slot 1 item
  5. onboard eMMC 13 items
  6. onboard eMMC 2 items
  7. SATA channels ≥ 1 19 items
  8. SATA channels ≥ 2 16 items
  9. SATA channels ≥ 3 2 items
  10. SATA channels ≥ 4 1 item
  11. SD interface 8 items
  12. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 20 items
  2. -20°C ÷ +70°C 3 items
  3. -40°C ÷ +85°C 25 items
  4. 0°C ÷ +50°C 24 items
  5. 0°C ÷ +60°C 25 items
  6. 20°C ÷ +70°C 18 items
  7. -20°C ÷ +70°C 7 items
Pci Express
  1. PCI-e lanes ≥ 1 22 items
  2. PCI-e lanes ≥ 2 22 items
  3. PCI-e lanes ≥ 3 19 items
  4. PCI-e lanes ≥ 4 17 items
  5. PCI-e lanes ≥ 5 12 items
Ttl Uarts
  1. TTL Uarts ≥1 24 items
  2. TTL Uarts ≥2 20 items
  3. TTL Uarts ≥3 5 items
USB
  1. USB 2.0 ≥ 1 23 items
  2. USB 2.0 ≥ 2 23 items
  3. USB 2.0 ≥ 3 23 items
  4. USB 2.0 ≥ 4 22 items
  5. USB 2.0 ≥ 5 20 items
  6. USB 2.0 ≥ 6 17 items
  7. USB 3.0 ≥ 1 14 items
  8. USB 3.0 ≥ 2 12 items
  9. USB 3.0 ≥ 3 9 items
  10. USB 3.0 ≥ 4 5 items
  11. USB 3.1 ≥ 1 11 items
  12. USB 3.1 ≥ 2 7 items
  13. USB 3.2 ≥ 1 2 items
  14. USB 3.2 ≥ 2 2 items
  15. USB CLIENT 1 item
  16. USB OTG 3 items
Video Interfaces
  1. DDI 10 items
  2. DP 15 items
  3. DP++ 4 items
  4. DUAL CHANNEL LVDS 18 items
  5. eDP 19 items
  6. HDMI 16 items
  7. MIPI-CSI camera conn 4 items
  8. MIPI-DSI 3 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 15 items
  11. VGA 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. ONBOARD WI-FI/BLE 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)