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COM Express®
COM-HPC®
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  1. Form Factor Specification
    Qseven 70x70 mm
  2. Pci Express
    PCI-e lanes ≥ 3
  3. Video Interfaces
    SINGLE CHANNEL LVDS
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Cpu Power Consumption
  1. range 10-25 W 3 items
  2. range < 10 W 3 items
Cpu Type
  1. Intel® Atom™ 3 items
  2. Intel® Celeron® 3 items
  3. Intel® Pentium® 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 3 items
  2. ≤ 80 x 80mm 3 items
Form Factor Specification
  1. COM Express Basic 3 items
  2. COM Express Compact 10 items
  3. Qseven 70x70 mm 3 items
  4. µQseven 70x40 1 item
Memory
  1. memory ≤1 3 items
  2. memory ≤2 3 items
  3. memory ≤4 3 items
  4. memory ≤8 3 items
  5. soldered down 3 items
Mass Storage
  1. onboard SSD 1 item
  2. onboard eMMC 2 items
  3. SATA channels ≥ 1 3 items
  4. SATA channels ≥ 2 3 items
  5. SD interface 3 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 6 items
  2. PCI-e lanes ≥ 2 4 items
  3. PCI-e lanes ≥ 3 3 items
  4. PCI-e lanes ≥ 4 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 3 items
  7. USB 3.0 ≥ 1 3 items
  8. USB 3.0 ≥ 2 1 item
Video Interfaces
  1. DP 2 items
  2. DP++ 1 item
  3. DUAL CHANNEL LVDS 3 items
  4. eDP 3 items
  5. HDMI 3 items
  6. MIPI-CSI camera conn 1 item
  7. SINGLE CHANNEL LVDS 3 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)