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COM Express®
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  1. Form Factor Specification
    Qseven 70x70 mm
  2. Mass Storage
    onboard SSD
  3. Video Interfaces
    HDMI
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Cpu Maker
  1. Intel 1 item
  2. NXP 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 2 items
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. NXP i.MX6 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 items
  2. ≤ 80 x 80mm 2 items
Form Factor Specification
  1. Qseven 70x70 mm 2 items
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. memory ≤8 1 item
  5. soldered down 2 items
Mass Storage
  1. onboard SSD 2 items
  2. microSD card slot 2 items
  3. onboard eMMC 5 items
  4. SATA channels ≥ 1 5 items
  5. SATA channels ≥ 2 3 items
  6. SD interface 5 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
  8. USB OTG 1 item
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 2 items
  3. eDP 1 item
  4. HDMI 2 items
  5. MIPI-CSI camera conn 1 item
  6. SINGLE CHANNEL LVDS 2 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)