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COM Express®
COM-HPC®
Qseven®
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Trizeps SODIMM (SOM)

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  1. Cpu Maker
    NXP
  2. Ttl Uarts
    TTL Uarts ≥1
  3. Video Interfaces
    eDP
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Cpu Maker
  1. AMD 3 items
  2. Intel 17 items
  3. MediaTek 1 item
  4. NXP 3 items
  5. Qualcomm 2 items
Cpu Power Consumption
  1. range < 10 W 2 items
Cpu Type
  1. NXP i.MX 8M 1 item
  2. NXP i.MX 8M Mini 1 item
  3. NXP i.MX 8M Nano 1 item
  4. NXP i.MX 8X 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. Qseven 2 items
  2. SMARC 1 item
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  2. ≤ 100 x 100mm 3 items
  3. ≤ 80 x 80mm 3 items
Form Factor Specification
  1. Qseven 70x70 mm 1 item
  2. µQseven 70x40 1 item
Memory
  1. memory ≤1 3 items
  2. memory ≤2 3 items
  3. memory ≤4 3 items
  4. soldered down 3 items
Mass Storage
  1. microSD card slot 1 item
  2. onboard eMMC 3 items
  3. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 3 items
Ttl Uarts
  1. TTL Uarts ≥1 3 items
  2. TTL Uarts ≥2 3 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 3.0 ≥ 1 2 items
  7. USB 3.0 ≥ 2 1 item
  8. USB OTG 1 item
Video Interfaces
  1. DP 2 items
  2. DUAL CHANNEL LVDS 9 items
  3. eDP 3 items
  4. HDMI 7 items
  5. MIPI-CSI camera conn 2 items
  6. MIPI-DSI 6 items
  7. PARALLEL RGB 3 items
  8. SINGLE CHANNEL LVDS 10 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)