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  1. Cpu Maker
    Intel
  2. Memory
    memory ≤8
  3. Mass Storage
    M.2 NVMe SSD slot
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Cpu Maker
  1. Intel 2 items
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 1 item
  2. COM-HPC® 1 item
Form Factor Dimensions
  1. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. COM-HPC Client 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤16 2 items
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 2 items
  6. memory ≥32 4 items
  7. SO_DIMM 5 items
Mass Storage
  1. onboard SSD 1 item
  2. CFAST slot 1 item
  3. M.2 NVMe SSD slot 2 items
  4. microSD card slot 2 items
  5. onboard eMMC 13 items
  6. SATA channels ≥ 1 18 items
  7. SATA channels ≥ 2 16 items
  8. SATA channels ≥ 3 3 items
  9. SATA channels ≥ 4 1 item
  10. SD interface 7 items
Operating Temperature
  1. 0°C ÷ +50°C 2 items
  2. 0°C ÷ +60°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 2 items
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.0 ≥ 4 1 item
  11. USB 3.1 ≥ 1 1 item
  12. USB 3.1 ≥ 2 1 item
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 1 item
Video Interfaces
  1. DDI 2 items
  2. DP 2 items
  3. DUAL CHANNEL LVDS 1 item
  4. eDP 2 items
  5. HDMI 2 items
  6. MIPI-CSI camera conn 1 item
  7. SINGLE CHANNEL LVDS 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)