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  1. Cpu Maker
    Intel
  2. Form Factor Specification
    COM Express Compact
  3. Operating Temperature
    -20°C ÷ +70°C
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Cpu Maker
  1. Intel 2 items
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 1 item
Form Factor Specification
  1. COM Express Compact 2 items
Memory
  1. memory ≤1 2 items
  2. memory ≤16 2 items
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 2 items
  6. memory ≥32 2 items
  7. SO_DIMM 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. SATA channels ≥ 1 2 items
  3. SATA channels ≥ 2 2 items
Operating Temperature
  1. -20°C ÷ +60°C 7 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 6 items
  4. 0°C ÷ +50°C 6 items
  5. 0°C ÷ +60°C 6 items
  6. 20°C ÷ +70°C 5 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 2 items
  7. USB 3.2 ≥ 1 1 item
  8. USB 3.2 ≥ 2 1 item
Video Interfaces
  1. DDI 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. eDP 1 item
  4. SINGLE CHANNEL LVDS 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)