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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Fanless embedded computer with the Intel Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

Fanless Embedded PCs

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  1. Ethernet
    ETHERNET≥2
  2. Memory
    soldered down
  3. Video Interfaces
    DP++
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Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 3 items
Cpu Type
  1. Intel® Atom™ 4 items
  2. Intel® Celeron® 2 items
  3. Intel® Pentium® 2 items
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 5 items
Form Factor
  1. Boxed Solutions 4 items
  2. Single Board Computer 1 item
Form Factor Dimensions
  1. ≥ 100 x 100mm 3 items
Memory
  1. memory ≤1 3 items
  2. memory ≤16 1 item
  3. memory ≤2 4 items
  4. memory ≤4 3 items
  5. memory ≤8 4 items
  6. memory ≥32 1 item
  7. soldered down 5 items
  8. SO_DIMM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. M.2 SATA SSD slot 4 items
  3. onboard eMMC 3 items
  4. onboard eMMC 2 items
  5. SATA channels ≥ 1 2 items
Operating Temperature
  1. 0°C ÷ +50°C 4 items
  2. 0°C ÷ +60°C 3 items
Ttl Uarts
  1. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 3.0 ≥ 1 2 items
  4. USB 3.0 ≥ 2 2 items
  5. USB 3.2 ≥ 2 1 item
Video Interfaces
  1. DP 2 items
  2. DP++ 5 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 4 items