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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Fanless embedded computer with the Intel Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

Fanless Embedded PCs

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    Intel
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    Intel® Celeron®
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Cpu Maker
  1. Intel 5 items
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 5 items
  2. Intel® Celeron® 5 items
  3. Intel® Core™ 4 items
  4. Intel® Pentium® 3 items
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 5 items
Form Factor
  1. Boxed Solutions 4 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤16 2 items
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 3 items
  6. memory ≥32 2 items
  7. soldered down 2 items
  8. SO_DIMM 2 items
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. M.2 SATA SSD slot 2 items
  3. microSD card slot 1 item
  4. onboard eMMC 2 items
  5. onboard eMMC 1 item
  6. SATA channels ≥ 1 1 item
Operating Temperature
  1. 0°C ÷ +50°C 3 items
  2. 0°C ÷ +60°C 1 item
Ttl Uarts
  1. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 3.0 ≥ 1 1 item
  4. USB 3.2 ≥ 1 1 item
  5. USB 3.2 ≥ 2 2 items
Video Interfaces
  1. DP++ 4 items
  2. HDMI 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. M.2 SOCKET 2 KEY 4 items
  3. M.2 Socket 2 key B 1 item
  4. ONBOARD WI-FI/BLE 2 items