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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC)

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Cpu Maker
  1. AMD 1 item
  2. NXP 9 items
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 6 items
Cpu Type
  1. NXP i.MX 8M 1 item
  2. NXP i.MX 8M Mini 1 item
  3. NXP i.MX 8M Nano 1 item
  4. NXP i.MX 8M Plus 1 item
  5. NXP i.MX 8X 1 item
  6. NXP i.MX 933/935 1 item
  7. NXP i.MX6 3 items
  8. NXP i.MX8 1 item
  9. Zynq® Ultras 1 item
Ethernet
  1. ETHERNET≥1 8 items
  2. ETHERNET≥2 4 items
Form Factor
  1. Qseven 4 items
  2. SMARC 5 items
  3. Modular HMIs 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. ≤ 100 x 100mm 7 items
  4. ≤ 80 x 80mm 8 items
  5. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. Qseven 70x70 mm 2 items
  2. µQseven 70x40 2 items
InstallationDepth
  1. 30-35 1 item
  2. memory ≤4 1 item
  3. memory ≤1 1 item
  4. memory ≤2 1 item
  5. soldered down 1 item
Memory
  1. memory ≤1 9 items
  2. memory ≤2 9 items
  3. memory ≤4 7 items
  4. memory ≤8 1 item
  5. soldered down 9 items
Mounting Option
  1. Rear Mount 1 item
Mass Storage
  1. onboard SSD 1 item
  2. I2C EEPROM 1 item
  3. microSD card slot 12 items
  4. onboard eMMC 2 items
  5. onboard eMMC 27 items
  6. onboard eMMC 13 items
  7. SATA channels ≥ 1 3 items
  8. SATA channels ≥ 2 1 item
  9. SD interface 10 items
  10. SD interface 11 items
  11. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  12. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 7 items
  2. -40°C ÷ +85°C 8 items
  3. 0°C ÷ +50°C 8 items
  4. 0°C ÷ +60°C 10 items
  5. 20°C ÷ +70°C 7 items
Pci Express
  1. PCI-e lanes ≥ 1 8 items
  2. PCI-e lanes ≥ 2 3 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
ScreenDimension
  1. 1 item
  2. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 7 items
  2. TTL Uarts ≥2 6 items
  3. TTL Uarts ≥3 4 items
USB
  1. USB 2.0 ≥ 1 9 items
  2. USB 2.0 ≥ 2 9 items
  3. USB 2.0 ≥ 3 6 items
  4. USB 2.0 ≥ 4 5 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 5 items
  7. USB 3.0 ≥ 2 4 items
  8. USB OTG 8 items
Video Interfaces
  1. DP 2 items
  2. DUAL CHANNEL LVDS 8 items
  3. eDP 2 items
  4. HDMI 6 items
  5. MIPI-CSI camera conn 2 items
  6. MIPI-DSI 3 items
  7. SINGLE CHANNEL LVDS 9 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 5 items
  2. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item