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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC)

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Cpu Type
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  2. NXP i.MX 8M Mini 1 item
  3. NXP i.MX 8M Nano 1 item
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Form Factor Dimensions
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  2. ≤ 100 x 100mm 1 item
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Form Factor Specification
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Memory
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  2. memory ≤2 16 items
  3. memory ≤4 13 items
  4. memory ≤8 4 items
  5. memory ≥32 1 item
  6. soldered down 12 items
  7. SO_DIMM 1 item
Mass Storage
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  2. onboard eMMC 3 items
  3. onboard eMMC 1 item
  4. SD interface 1 item
Operating Temperature
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  2. -20°C ÷ +70°C 1 item
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Ttl Uarts
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USB
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  6. MIPI-DSI 6 items
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  8. SINGLE CHANNEL LVDS 6 items
Wireless Connectivity
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  2. M.2 SOCKET 2 KEY 2 items
  3. ONBOARD WI-FI/BLE 1 item