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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC)

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  1. Cpu Type
    NXP i.MX6
  2. Operating Temperature
    0°C ÷ +50°C
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Shopping Options
Cpu Power Consumption
  1. range < 10 W 2 items
Cpu Type
  1. MediaTek Genio 510 1 item
  2. MediaTek Genio 700 1 item
  3. NXP i.MX 8M 4 items
  4. NXP i.MX 8M Mini 2 items
  5. NXP i.MX 8M Nano 1 item
  6. NXP i.MX 8X 2 items
  7. NXP i.MX 95 1 item
  8. NXP i.MX6 7 items
  9. NXP i.MX8 3 items
  10. Qualcomm® QCS5430 1 item
  11. Qualcomm® QCS6490 1 item
  12. Rockchip RK3399 2 items
  13. Rockchip RK3568 1 item
  14. Zynq® Ultras 1 item
  15. Qualcomm Dragonwing IQ-X 1 item
Ethernet
  1. ETHERNET≥1 6 items
  2. ETHERNET≥2 1 item
Form Factor
  1. Qseven 2 items
  2. Modular HMIs 3 items
  3. Single Board Computer 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 1 item
  3. ≤ 80 x 80mm 1 item
  4. ≥ 100 x 100mm 3 items
Form Factor Specification
  1. Other SBCs 2 items
  2. Qseven 70x70 mm 1 item
  3. µQseven 70x40 1 item
InstallationDepth
  1. 30-35 2 items
  2. 35-40 1 item
Memory
  1. memory ≤1 6 items
  2. memory ≤2 3 items
  3. memory ≤4 1 item
  4. soldered down 2 items
Mounting Option
  1. Rear Mount 1 item
  2. Flush Mount 1 item
Mass Storage
  1. onboard SSD 1 item
  2. microSD card slot 3 items
  3. onboard eMMC 4 items
  4. onboard eMMC 3 items
  5. SATA channels ≥ 1 1 item
  6. SD interface 3 items
  7. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 7 items
  4. 0°C ÷ +60°C 9 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
ScreenDimension
  1. 10-14 1 item
  2. 2 items
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 7 items
  2. USB 2.0 ≥ 2 6 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB OTG 6 items
Video Interfaces
  1. DUAL CHANNEL LVDS 4 items
  2. HDMI 4 items
  3. MIPI-CSI camera conn 1 item
  4. SINGLE CHANNEL LVDS 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 SOCKET 2 KEY 1 item