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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 processor. (E81)

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 processor. (E81)

AI-Optimized Hardware

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  1. Memory
    memory ≤16
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    -20°C ÷ +70°C
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Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤16 1 item
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 2 items
  6. memory ≥32 1 item
  7. soldered down 1 item
  8. SO_DIMM 1 item
Mass Storage
  1. M.2 SATA SSD slot 1 item
  2. SATA channels ≥ 1 1 item
  3. SATA channels ≥ 2 1 item
  4. SATA channels ≥ 3 1 item
  5. SATA channels ≥ 4 1 item
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 1 item
  4. 0°C ÷ +50°C 3 items
  5. 0°C ÷ +60°C 3 items
  6. 20°C ÷ +70°C 3 items
  7. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
USB
  1. USB 3.2 ≥ 1 1 item
  2. USB 3.2 ≥ 2 1 item