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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 processor. (E81)

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 processor. (E81)

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  1. Cpu Type
    Intel® Core™
  2. Mass Storage
    SATA channels ≥ 2
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Cpu Type
  1. Intel® Core™ 2 items
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 1 item
  2. COM-HPC® 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. COM-HPC Client 1 item
Memory
  1. memory ≥32 2 items
  2. SO_DIMM 1 item
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. M.2 SATA SSD slot 2 items
  3. SATA channels ≥ 2 2 items
  4. SATA channels ≥ 2 1 item
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +60°C 1 item
Ttl Uarts
  1. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 4 1 item
  2. USB 3.2 ≥ 2 1 item
  3. USB 4.0 ≥ 2 1 item
  4. USB 4.0 ≥ 4 1 item
  5. USB OTG 1 item
Video Interfaces
  1. DDI 2 items
  2. DP 2 items
  3. DP++ 1 item
  4. DUAL CHANNEL LVDS 1 item
  5. eDP 2 items
  6. HDMI 2 items
  7. MIPI-CSI camera conn 1 item
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item