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SMARC® Rel. 2.1.1 module with NXP i.MX 952 Applications Processor
Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics
COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)
Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS
SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)
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