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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 processor. (E81)

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 processor. (E81)

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Cpu Power Consumption
  1. range 10-25 W 1 item
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Ethernet
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Form Factor
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Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
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Form Factor Specification
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Memory
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  3. memory ≤4 1 item
  4. memory ≤8 1 item
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  6. soldered down 1 item
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Mass Storage
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  3. SATA channels ≥ 1 1 item
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  5. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
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  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 1 item
  5. 20°C ÷ +70°C 1 item
Pci Express
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Ttl Uarts
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USB
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  7. USB 3.0 ≥ 1 1 item
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Video Interfaces
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  6. MIPI-CSI camera conn 1 item
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Wireless Connectivity
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