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  1. Pci Express
    PCI-e lanes ≥ 5
  2. Video Interfaces
    MIPI-CSI camera conn
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Cpu Maker
  1. Intel 3 items
  2. Qualcomm 1 item
Cpu Type
  1. Intel® Core™ 3 items
  2. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 5 items
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 4 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 items
  2. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 3 items
  2. COM Express Compact 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤16 1 item
  3. memory ≤2 1 item
  4. memory ≤4 1 item
  5. memory ≤8 1 item
  6. memory ≥32 3 items
  7. soldered down 1 item
  8. SO_DIMM 1 item
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. soldered down 1 item
  2. M.2 NVMe SSD slot 1 item
  3. M.2 SATA SSD slot 2 items
  4. SATA channels ≥ 1 2 items
  5. SATA channels ≥ 2 1 item
  6. SATA channels ≥ 2 1 item
  7. SATA channels ≥ 2 2 items
  8. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 7 items
  2. PCI-e lanes ≥ 2 6 items
  3. PCI-e lanes ≥ 3 4 items
  4. PCI-e lanes ≥ 4 7 items
  5. PCI-e lanes ≥ 5 5 items
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 2 items
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.0 ≥ 4 2 items
  11. USB 4.0 ≥ 1 1 item
  12. USB 4.0 ≥ 2 3 items
  13. USB 4.0 ≥ 3 1 item
  14. USB 4.0 ≥ 4 1 item
  15. USB OTG 2 items
Video Interfaces
  1. DDI 18 items
  2. DP 13 items
  3. DP++ 6 items
  4. DUAL CHANNEL LVDS 16 items
  5. eDP 23 items
  6. HDMI 18 items
  7. MIPI-CSI camera conn 5 items
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 14 items
  11. VGA 4 items
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