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  1. Mass Storage
    SD interface
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Cpu Maker
  1. NXP 3 items
  2. Qualcomm 1 item
Cpu Type
  1. NXP i.MX 8M Mini 2 items
  2. NXP i.MX 8M Nano 1 item
  3. NXP i.MX6 1 item
  4. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 3 items
Form Factor
  1. SMARC 1 item
  2. Trizeps SODIMM SOM 2 items
  3. Single Board Computer 1 item
  4. Single Board Computer 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
Form Factor Specification
  1. Other SBCs 3 items
Memory
  1. memory ≤1 3 items
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
  5. soldered down 1 item
  6. memory ≤32 1 item
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 3 items
  3. standard SATA connector 2 items
  4. soldered down 1 item
  5. CFAST slot 1 item
  6. M.2 NVMe SSD slot 3 items
  7. M.2 SATA SSD slot 5 items
  8. microSD card slot 12 items
  9. onboard eMMC 1 item
  10. onboard eMMC 29 items
  11. onboard eMMC 7 items
  12. SATA channels ≥ 1 20 items
  13. SATA channels ≥ 1 3 items
  14. SATA channels ≥ 2 3 items
  15. SATA channels ≥ 2 12 items
  16. SATA channels ≥ 3 3 items
  17. SATA channels ≥ 4 1 item
  18. SD interface 14 items
  19. SD interface 6 items
  20. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 3 items
  4. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥2 1 item
  2. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 4 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 4 1 item
  4. USB 2.0 ≥ 5 1 item
  5. USB 3.0 ≥ 2 1 item
  6. USB OTG 5 items
Video Interfaces
  1. DP 3 items
  2. DUAL CHANNEL LVDS 8 items
  3. eDP 2 items
  4. HDMI 4 items
  5. MIPI-CSI camera conn 3 items
  6. MIPI-DSI 3 items
  7. PARALLEL RGB 2 items
  8. SINGLE CHANNEL LVDS 6 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 SOCKET 2 KEY 1 item
  3. ONBOARD WI-FI/BLE 2 items
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