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  1. Mass Storage
    SD interface
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    TTL Uarts ≥2
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Cpu Maker
  1. Qualcomm 2 items
Cpu Type
  1. Qualcomm® QCS5430 1 item
  2. Qualcomm® QCS6490 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 2 items
Form Factor
  1. SMARC 2 items
  2. Trizeps SODIMM SOM 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 items
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. memory ≤8 2 items
  5. soldered down 2 items
Mass Storage
  1. onboard SSD 1 item
  2. standard SATA connector 1 item
  3. soldered down 1 item
  4. M.2 NVMe SSD slot 3 items
  5. M.2 SATA SSD slot 2 items
  6. microSD card slot 5 items
  7. onboard eMMC 22 items
  8. onboard eMMC 2 items
  9. SATA channels ≥ 1 13 items
  10. SATA channels ≥ 1 1 item
  11. SATA channels ≥ 2 3 items
  12. SATA channels ≥ 2 8 items
  13. SATA channels ≥ 3 1 item
  14. SATA channels ≥ 4 1 item
  15. SD interface 8 items
  16. SD interface 3 items
  17. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. 0°C ÷ +50°C 2 items
  3. 0°C ÷ +60°C 2 items
  4. 20°C ÷ +70°C 2 items
  5. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 3 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 3.1 ≥ 1 2 items
  6. USB OTG 1 item
Video Interfaces
  1. DP 2 items
  2. DUAL CHANNEL LVDS 3 items
  3. eDP 2 items
  4. HDMI 1 item
  5. MIPI-CSI camera conn 1 item
  6. MIPI-DSI 2 items
  7. PARALLEL RGB 1 item
  8. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 1 item
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