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  1. Form Factor
    SMARC
  2. Pci Express
    PCI-e lanes ≥ 4
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Cpu Maker
  1. AMD 1 item
  2. Intel 5 items
  3. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 4 items
  2. range < 10 W 3 items
Cpu Type
  1. Intel® Atom™ 4 items
  2. Intel® Celeron® 2 items
  3. Intel® Core™ 2 items
  4. Intel® Pentium® 2 items
  5. Zynq® Ultras 1 item
  6. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 4 items
  2. ETHERNET≥2 8 items
Form Factor
  1. COM Express® 16 items
  2. COM-HPC® 3 items
  3. Qseven 3 items
  4. SMARC 8 items
  5. Single Board Computer 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 6 items
  2. ≤ 80 x 80mm 5 items
Memory
  1. memory ≤1 4 items
  2. memory ≤16 3 items
  3. memory ≤2 4 items
  4. memory ≤4 4 items
  5. memory ≤8 4 items
  6. memory ≥32 1 item
  7. soldered down 7 items
  8. memory ≤32 1 item
Mass Storage
  1. M.2 SATA SSD slot 1 item
  2. microSD card slot 1 item
  3. onboard eMMC 6 items
  4. SATA channels ≥ 1 6 items
  5. SD interface 2 items
  6. SD interface 1 item
  7. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 6 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 6 items
  5. 20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 10 items
  2. PCI-e lanes ≥ 2 8 items
  3. PCI-e lanes ≥ 3 4 items
  4. PCI-e lanes ≥ 4 8 items
Ttl Uarts
  1. TTL Uarts ≥1 4 items
  2. TTL Uarts ≥2 5 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 5 items
  2. USB 2.0 ≥ 2 4 items
  3. USB 2.0 ≥ 3 4 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 4 items
  6. USB 2.0 ≥ 6 5 items
  7. USB 3.0 ≥ 1 3 items
  8. USB 3.0 ≥ 2 3 items
  9. USB 3.1 ≥ 1 2 items
  10. USB 3.1 ≥ 2 1 item
  11. USB 3.2 ≥ 1 1 item
  12. USB 3.2 ≥ 2 2 items
  13. USB OTG 2 items
Video Interfaces
  1. DP 3 items
  2. DP++ 6 items
  3. DUAL CHANNEL LVDS 6 items
  4. eDP 5 items
  5. HDMI 4 items
  6. MIPI-CSI camera conn 5 items
  7. MIPI-DSI 2 items
  8. SINGLE CHANNEL LVDS 3 items
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