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Cpu Maker
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  2. Qualcomm 1 item
Cpu Type
  1. NXP i.MX6 1 item
  2. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 3 items
Form Factor
  1. SMARC 1 item
  2. Trizeps SODIMM SOM 1 item
  3. Single Board Computer 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
Form Factor Specification
  1. Other SBCs 1 item
Memory
  1. memory ≤1 1 item
  2. soldered down 1 item
  3. memory ≤32 1 item
Mass Storage
  1. onboard SSD 2 items
  2. standard SATA connector 2 items
  3. M.2 NVMe SSD slot 1 item
  4. M.2 SATA SSD slot 5 items
  5. microSD card slot 5 items
  6. onboard eMMC 1 item
  7. onboard eMMC 13 items
  8. onboard eMMC 2 items
  9. SATA channels ≥ 1 4 items
  10. SATA channels ≥ 1 2 items
  11. SD interface 6 items
  12. SD interface 3 items
  13. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 2 items
  4. -20°C ÷ +70°C 1 item
Pci Express
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Ttl Uarts
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USB
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  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 5 1 item
  4. USB 3.0 ≥ 2 1 item
  5. USB OTG 2 items
Video Interfaces
  1. DP 3 items
  2. DUAL CHANNEL LVDS 5 items
  3. eDP 2 items
  4. HDMI 1 item
  5. MIPI-CSI camera conn 2 items
  6. MIPI-DSI 3 items
  7. PARALLEL RGB 1 item
  8. SINGLE CHANNEL LVDS 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. ONBOARD WI-FI/BLE 1 item
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