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HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - PackagedDevelopment Kits & Accessories Accessories Heat Spreaders Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
Palladio 500 RPL AIModular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 GraphicsProcessor Intel Processor Fanless Embedded PCs AI-Optimized Hardware -
SOM-COMe-CT6-TWLCOM Express® Rel. 3.1 Type 6 Module with Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)x86 COM Express® Intel Processor -
SOM-COMe-CT6-TGL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Processors. (CALYPSO - D40)x86 COM Express® Intel Processor -
SOM-COMe-CT6-EHLCOM Express® 3.1 Type 6 Compact Computer on Module (CoM) with Intel Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (Codename: Elkhart Lake). (E37)x86 COM Express® Intel Processor -
SOM-COMe-CT6-WHL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 8th Gen Intel® Core™ and Celeron™ U-series (Codename: Whiskey Lake-U) Processors. (LARISSA - C55)x86 COM Express® Intel Processor