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SOM-COM-HPC-A-TGL-UP3
Höhepunkte
GraphicsIntel® Iris Xe Graphics Core Gen12 GPU mit bis zu 96 EU, bis zu 4 unabhängige Displays
MemoryZwei DDR4 SO-DIMM-Steckplätze für DDR4-3200 ECC-Speicher
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Entdecken Sie die mit diesem Produkt kompatiblen Anwendungen, die im SECO Application Hub verfügbar sind: einsatzbereite Lösungen zur Beschleunigung der Entwicklung und Bereitstellung intelligenter Funktionen.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
DEV-KIT-COM-HPC-A
Beschreibung
|
COM-HPC® Client-Modul Größe A mit Intel® Core™- und Celeron®-Prozessoren der 11. Generation (ehemals Tiger Lake-UP3) |
|---|---|
CPU Description
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Intel® Core™ und Celeron® Prozessoren der 11. Generation, auch im industriellen Temperaturbereich erhältlich |
|
Max Cores
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4 |
Memory Description
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2x DDR4-3200 SODIMM Slots mit IBECC (In-Band Error Correction Code), bis zu 64GB unterstützt |
Graphics Description
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Integrierte Iris Xe Graphics Core Gen12 Architektur, mit bis zu 96 Ausführungseinheiten |
Video Interfaces Description
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1x eDP 1.4b oder MIPI_DSI 1.3 |
Video Resolution Description
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DP, eDP: bis zu 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp mit DSC |
|
Mass Storage Description
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2 x S-ATA Gen3-Kanäle |
Networking Description
|
Bis zu 2x NBase-T-Ethernet-Schnittstellen, die eine 2,5-Gb-Ethernet-Verbindung unterstützen, verwaltet von ebenso vielen Intel® i225 2,5-GbE-Controllern |
USB Description
|
bis zu 4 x USB 4.0 / USB 3.2 Host Anschlüsse |
PCI Description
|
1x PCI-e x4 Gen 4-Anschluss |
Audio Description
|
SoundWire and I2S Audio Interface |
Serial Ports
|
2 x UARTs |
Other Interfaces
|
2x 4-Lane CSI-2 Schnittstellen, optional |
|
Power Supply
|
+8VDC .. +20VDC Main power supply |
Operating System
|
Windows 10 IoT Enterprise LTSC |
Operating Temperature Description
|
0°C ÷ +60°C (kommerzielle Version) *Gemessen an einem beliebigen Punkt des SECO Standard-Wärmeverteilers für dieses Produkt, während |
Dimensions
|
120 x 95 mm (Com HPC Size A Form factor, Client pinout) |
Teilenummer
COM-HPC - CARINA w/Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost), 8MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
COM-HPC - CARINA w/Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) 12MB Cache, with IBECC and FuSa, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.
COM-HPC - CARINA w/Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost), 12MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
COM-HPC - CARINA w/Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
COM-HPC - CARINA w/ Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost), 8MB Cache, with IBECC and FuSa, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.
COM-HPC - CARINA w/ Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost), 6MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
COM-HPC - CARINA w/Intel® Core i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost), 6MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.
Accessories