SOM-COMe-BT7-E3000

AMD EPYC™組込み型3000シリーズのSoCを搭載したCOM Express® Rel.3.0 Basic Type 7 モジュール。詳細はこちらをご覧ください。 . (THEBE - C42)

工業用温度範囲で使用可能

データシート

Wiki

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CPU

AMD EPYC™ Embedded 3000 family of SoCs

グラフィック

N.A.

接続性

4x USB 3.1; 24x PCI-e Gen3 lanes

メモリ

Four DDR4 SO-DIMM Slots supporting DDR4-2666 Memory with ECC, up to 128GB

製品詳細

技術情報

商品説明	This innovative Computer on Module (CoM) provides scalable offerings with outstanding performance and more connectivity. Networking and connectivity are improved with the 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI and the 4 USB 3.1; 24x PCI-e Gen3 lanes. Moreover, the performance is enhanced by the four DDR4 SO-DIMM slots supporting DDR4-2666 memory with ECC, up to 128GB. The AMD EPYC™ Embedded 3000 shows major improvements in power, optimization, and security. The main features of this new processor are I/O integration, flexibility, and security capabilities, scalable offering, harnessing the power of the new “Zen” CPU architecture. Performance-per-dollar is greatly improved, making it a great choice for development.
Cpu	AMD EPYC™ Embedded 3000 family of SoCs: AMD EPYC™ Embedded 3451, Sixteen Core Dual Thread @ 2.14GHz (3.0 Boost), 32MB L3 shared Cache, TDP 80-100W AMD EPYC™ Embedded 3351, Twelve Core Dual Thread @ 1.9GHz (3.0 Boost), 32MB L3 shared Cache, TDP 60-80W AMD EPYC™ Embedded 3251, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 55W AMD EPYC™ Embedded 3201, Eight Core Single Thread @ 1.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 30W AMD EPYC™ Embedded 3151, Quad Core Dual Thread @ 2.7GHz (2.9 Boost), 16MB L3 shared Cache, TDP 45W AMD EPYC™ Embedded 3101, Quad Core Single Thread @ 2.1GHz (2.9 Boost), 8MB L3 shared Cache, TDP 35W AMD EPYC™ Embedded 3255, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 55W, industrial grade
メモリ	Up to 4x DDR4 SO-DIMM Slots supporting DDR4-2666 Memory (both ECC and not-ECC supported), up to 128GB
大容量記憶装置	2x S-ATA Gen3 Channels
ネットワーク	1x Gigabit Ethernet LAN port with NC-SI (Network Controller Sideband Interface) functionality, managed by an Intel® I210 Gigabit Ethernet Controller 4x 10Gigabit Ethernet interfaces (10GBASE-KR), directly managed by the EPYC™ SoCs
USB	4 x USB 3.1 Host ports (SS + USB 2.0 interfaces)
PCI	24x PCI-e Gen3 lanes
シリアルポート	2x legacy UARTs, 16C550 compatible
その他のインターフェース	SPI, SM Bus, LPC bus
セキュリティ	Optional TPM 2.0 module on-board AMD Secure Processor for Crypto Co-processing Hardware Validated Boot capabilities Secure Memory Encryption Secure Encrypted Virtualization
電源装置	+12VDC ± 10% and + 5VSB (optional)
OS	Microsoft® Windows 10 Microsoft® Windows Server 2016 Linux OS 64-bit
動作温度	0°C ÷ +60 °C (Commercial version) -40°÷+85°C (Industrial Range, when available) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
寸法	125 x 95 mm (Com Express™ Basic Form factor, Type 7 pinout)

ソフトウェア

リンク	SECO Technical Resources

文書化

Data Sheet	[Datasheet] SOM-COMe-BT7-E3000 Rel 1.3
Manual	[Manual] SOM-COMe-CT6-MBPF Rel 1.0
Image	[Picture] SOM-COMe-CT6-MBPF_front [Picture] SOM-COMe-CT6-MBPF_back

品番

グループ製品アイテム
THEBE	品番内容 AMD EPYC™組込み型3000シリーズのSoCを搭載したCOM Express® Rel.3.0 Basic Type 7 モジュール。詳細はこちらをご覧ください。	お問い合わせ
THEBE	品番内容 AMD EPYC™組込み型3000シリーズのSoCを搭載したCOM Express® Rel.3.0 Basic Type 7 モジュール。詳細はこちらをご覧ください。	お問い合わせ
THEBE	品番内容 AMD EPYC™組込み型3000シリーズのSoCを搭載したCOM Express® Rel.3.0 Basic Type 7 モジュール。詳細はこちらをご覧ください。	お問い合わせ