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SOM-SMARC-MX8X
NXP i.MX 8X アプリケーションプロセッサ搭載のSMARC® Rel.2.1.1モジュール .
(SWAN - D16)
CPU
NXP i.MX 8X Applications Processors
グラフィック
Integrated GPU, supports 2 independent displays
接続性
2x Gigabit Ethernet; opt. Wi-Fi +BT 5.0; CSI camera; 2x USB 3.0; 3x USB2.0; 1x PCI-e x1; 2x CAN Bus; 4xUART; 14x GPI/Os; QuadSPI interface
メモリ
up to 4GB soldered down LPDDR4-2400 memory
製品詳細
商品説明
|
SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8X Applications Processors |
|---|---|
Cpu
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NXP i.MX 8X family SoCs: Dual or Quad ARM Cortex®-A35 Cores + 1x Cortex® M4F core for real-time processing
|
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最大コア数
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4+1 |
|
メモリ
|
Soldered down LPDDR4 memory @ 1200MHz, 32-bit interface, up to 4GB |
|
グラフィック
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Embedded GC7000Lite GPU Supports OpenGL 3.0, 2.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and 1.1, OpenVG 1.1, and Vulkan Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV10, VP8, H.263 and MPEG4.2t, HW encoding of AVC/H.264 2 independent displays supported |
ビデオインターフェース
|
Factory alternatives: · 2x LVDS / Mipi-DSI Single Channel or 1xLVDS / Mipi-DSI Dual Channel 18-/24-bit interface · LVDS / Mipi-DSI Single Channel 18-/24-bit interface + HMDI interface · eDP 4-lane interface + LVDS / Mipi-DSI single Channel 18-/24-bit interface · eDP 4-lane interface + HMDI interface |
動画解像度
|
MIPI-DSI, LVDS, eDP, HDMI: Up to 1920 x 1080 @ 60Hz |
大容量記憶装置
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Optional Soldered onboard eMMC 5.1 Drive, up to 64GB SD 4-bit interface QSPI NOR Flash soldered on-board |
ネットワーク
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Up to 2 x Gigabit Ethernet interfaces On-board WiFi 802.11 a/b/g/n + BT LE 5.0 module, optional |
USB
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Up to 3 x USB 2.0 Host Ports 2 x USB 3.0 Host Ports |
|
PCI
|
1x PCI-e 3.0 x1 port |
オーディオ
|
Up to 2x I2S Audio interfaces |
シリアルポート
|
2x 2-wires UART 2x 4-wires UART |
その他のインターフェース
|
1x 4-lanes CSI camera interface 2x PWM Up to 14x GPIOs I2C bus SM bus SPI interface QuadSPI interface Watchdog Boot select signals Power Management Signals |
電源装置
|
+5VDC and +3.3V_RTC |
OS
|
Linux Android |
動作温度
|
0°C ÷ +60°C ** (Commercial version) -40°C ÷ +85°C (Industrial version)
**Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. |
寸法
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50 x 82 mm (1.97” x 3.23”) |
アクセサリ
