SOM-COMe-CT6-ASL
製品詳細
商品説明 | COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N) |
---|---|
Cpu | Intel® Atom® Processors x7000RE (Codename: Amston Lake) Series:
Intel Atom® Processors x7000E (Codename: Alder Lake N) Embedded E Series:
Intel® Core™ i3 Processors and Intel® Processor N Series (Codename: Alder Lake N) PC Client Processors
(*) TCC: Time Coordinated Computing |
メモリ | One DDR5 SO-DIMM slot supporting DDR5-4800 IBECC modules, up to 16GB
|
グラフィック | Integrated Intel® Gen12 UHD graphics controller with up to 32 EU |
ビデオインターフェース | 2x Digital Display Interfaces (DDIs), supporting DP, HDMI®, DP Alt-Mode over Type-C |
動画解像度 | HDMI®: up to 4Kx2K @60Hz according to HDMI 2.0b |
大容量記憶装置 | Up to 2x S-ATA Gen3 channels |
ネットワーク | 1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE controller, supporting 2.5GbE and TSN |
USB | Up to 2x USB 10Gbps |
PCI | Up to 6x PCI-e Gen3 lanes |
オーディオ | HD Audio interface |
シリアルポート | 2x UARTs |
その他のインターフェース | SPI, 2x I2C, SM Bus, Thermal Management, FAN management |
電源装置 | +12VDC ± 10%, +5VSB (optional), +3VRTC (optional) |
OS | Microsoft® Windows 10 IoT Enterprise 2019 LTSC |
動作温度 | 0°C ÷ +60°C (Commercial version)
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
寸法 | 95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout) |