SOM-COMe-BT6-MTL
製品詳細
商品説明 | COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U) |
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Cpu | Intel® Core™ Ultra Processors Family (Codename: Meteor Lake-H) - 20/28/65W base power:
Intel® Core™ Ultra Processors Family (Codename: Meteor Lake- U) - 12/15/28W Base Power:
|
メモリ | Two DDR5 SO-DIMM slot supporting DDR5-5600 IBECC modules, up to 64GB (*) IBECC: In-Band Error-Correcting Code Memory |
グラフィック | Integrated Intel® Xe LPG graphics controller with up to 8 Xe cores (128 EU) Support up to 4 independent displays |
ビデオインターフェース | 3x Digital Display Interfaces (DDIs), supporting DP, HDMI® 1x eDP or Single/Dual-Channel 18-/24-bit LVDS interface (factory alternatives) 2x MIPI CSI channels with single on-board connector (factory option) |
動画解像度 | HDMI®: up to 8K60 according to HDMI® 2.1 DP 2.1: up to 8K60Hz / 5K120Hz eDP 1.4b: up to 4K120Hz HDR Max resolution 4x4K60Hz |
大容量記憶装置 | Up to 2x S-ATA Gen3.2 channels (factory alternative to on-board NVMe + 1 PEG x4) Optional NVMe SSD (PCIE-e x4 interface) soldered on-board, up to 512GB |
ネットワーク | 1x NBase-T Ethernet interface with Intel® I226 GbE controller, supporting 2.5GbE and TSN |
USB | Up to 4x USB 10Gbps interfaces Up to 8x Hi-Speed USB interfaces |
PCI | 1x PEG x8 Gen4 (with H series processors only) 1x PEG x4 Gen4 (factory alternative to 2x SATA) 8x PCI-e lanes Gen4 (allowed groupings x4, x2, x1) |
オーディオ | HD Audio Soundwire Audio interfaces |
シリアルポート | 2x UARTs |
その他のインターフェース | SPI, I2C, SM Bus, thermal management, FAN management eSPI or LPC bus (factory alternatives) TPM 2.0 on-board (factory option) LID#/SLEEP#/PWRBTN#, watchdog 4 x GPI, 4 x GPO |
電源装置 | Main: +8Vdc ÷ +20Vdc Auxiliary: +5V_SBY, +3V_RTC |
OS | Microsoft® Windows 10 IoT Enterprise 2019 LTSC Microsoft® Windows 10 IoT Enterprise 2021 LTSC Yocto Kirkstone |
動作温度 | 0°C ÷ +60°C (Commercial version) *
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
寸法 | 125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout) |